參數(shù)資料
型號(hào): SY89112UMYTR
廠商: MICREL INC
元件分類(lèi): 時(shí)鐘及定時(shí)
英文描述: 89112 SERIES, LOW SKEW CLOCK DRIVER, 12 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), QCC44
封裝: 7 X 7 MM, LEAD FREE, MO-220, MLF-44
文件頁(yè)數(shù): 10/14頁(yè)
文件大小: 689K
代理商: SY89112UMYTR
Micrel, Inc.
SY89112U
March 2011
5
M9999-030211-E
hbwhelp@micrel.com or (408) 955-1690
Absolute Maximum Ratings
(1)
Supply Voltage (VCC).................................... 0.5V to +4.0V
Input Voltage (VIN).......................................... 0.5V to VCC
LVPECL Output Current (IOUT)
Continuous............................................................50mA
Surge ..................................................................100mA
Termination Current
Source or sink current on VT............................
±100mA
Input Current
Source or sink current on CLK, /CLK .................
±50mA
VREF-AC Current
Source or sink current...........................................
±2mA
Lead Temperature (soldering, 20sec)......................
+260°C
Storage Temperature (TS) ........................
65°C to +150°C
Operating Rating(2)
Supply Voltage (VCC)......................... +2.375V to +2.625V
+3.0V to +3.6V
Ambient Temperature (TA)....................... 40°C to +85°C
Package Thermal Resistance(3)
QFN (
θJA)
Still-Air......................................................42
°C/W
QFN (
ψJB)
Junction-to-Board ....................................20
°C/W
DC Electrical Characteristics
(4)
TA = –40°C to +85°C, unless otherwise stated.
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
VCC
Power Supply
2.375
3.0
2.625
3.6
V
ICC
Power Supply Current
No load, max. VCC
95
130
mA
RIN
Input Resistance (IN-to-VT)
45
50
55
RDIFF_IN
Differential Input Resistance (IN-to-/IN)
90
100
110
VIH
Input High Voltage (IN, /IN)
1.2
VCC
V
VIL
Input Low Voltage (IN, /IN)
0
VIH –0.1
V
VIN
Input Voltage Swing (IN, /IN)
See Figure 1a.
0.1
1.7
V
VDIFF_IN
Differential Input Voltage Swing
|IN–/IN|
See Figure 1b.
0.2
V
VT_IN
IN-to-VT (IN, /IN)
1.28
V
VREF-AC
Output Reference Voltage
VCC – 1.3
VCC – 1.2
VCC–1.1
V
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied
at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings conditions for extended
periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings
3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.
θJA and ΨJB values
are determined for a 4-layer board in still-air, unless otherwise stated.
4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
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