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參數(shù)資料
| 型號： | STPD0166BTI3 |
| 廠商： | 意法半導體 |
| 英文描述： | PC Compatible Embedded Microprocessor |
| 中文描述： | PC兼容嵌入式微處理器 |
| 文件頁數(shù)： | 41/48頁 |
| 文件大?。?/td> | 762K |
| 代理商： | STPD0166BTI3 |
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BOARD LAYOUT
Issue 1.7 - February 8, 2000
41/48
6. BOARD LAYOUT
6.1 THERMAL DISSIPATION
Thermal dissipation of the STPC depends mainly
on supply voltage. As a result, when the system
does not need to workat 3.3V, it may be to reduce
the voltage to 3.15V for example. This may save
few 100’s of mW.
The second area that can be concidered is un-
used interfaces and functions. Depending on the
application, some input signals can be grounded,
and some blocks not powered or shutdown. Clock
speed dynamic adjustment is also a solution that
can be usedalong with the integrated power man-
agement unit.
The standard way to route thermalballs to internal
ground layerimplements only one viapad for each
ball pad, connected using a 8-mil wire.
With such configuration the Plastic BGA 388 pack-
age dissipates 90%of the heat through theground
balls, and especially the central thermal balls
which are directly connected to the die, the re-
maining 10% is dissipated through the case. Add-
ing a heat sink reduces this value to 85%.
As a result, some basic rules have to be applied
when routing the STPC in order to avoid thermal
problems.
First of all, the whole ground layer acts as a heat
sink and ground balls must be directly connected
to it as illustrated in Figure 6-1.
If one ground layer is not enough, a second
ground plane may be added on the solder side.
Figure 6-1. Ground routing
Pad for ground ball
Thru hole to ground layer
TopLayer:Sgnas
Powerlayer
BotomLayer:sgnas+locagroundlayer(fneeded
Goundlayer
Note: For better visibility, ground balls are not all routed.
相關PDF資料 |
PDF描述 |
|---|---|
| STPCD0175BTC3 | PC Compatible Embedded Microprocessor |
| STPD0175BTC3 | PC Compatible Embedded Microprocessor |
| STPCD0175BTI3 | PC Compatible Embedded Microprocessor |
| STPD0175BTI3 | PC Compatible Embedded Microprocessor |
| STPD0166BTA3 | RP15 (F) Series - Powerline Regulated DC-DC Converters; Input Voltage (Vdc): 12V; Output Voltage (Vdc): 3.3V; 2:1 Wide Input Voltage Range; 15 Watts Output Power; 1.6kVDC Isolation; UL Certified; Fixed Operating Frequency; Six-Sided Continuous Shield; Standard 50.8 x25.4x10.2mm Package; Efficiency to 88% |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| STPD0175BTA3 | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:PC Compatible Embedded Microprocessor |
| STPD0175BTC3 | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:PC Compatible Embedded Microprocessor |
| STPD0175BTI3 | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:PC Compatible Embedded Microprocessor |
| STP-DRH05 | 功能描述:烙鐵 Cartridge Hoof 0.5mm (0.02in) RoHS:否 制造商:Weller 產(chǎn)品:Soldering Stations 類型:Digital, Iron, Stand, Cleaner 瓦特:50 W 最大溫度:+ 850 F 電纜類型:US Cord Included |
| STP-DRH15 | 功能描述:烙鐵 Cartridge Hoof 1.5mm (0.059in) RoHS:否 制造商:Weller 產(chǎn)品:Soldering Stations 類型:Digital, Iron, Stand, Cleaner 瓦特:50 W 最大溫度:+ 850 F 電纜類型:US Cord Included |
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