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參數(shù)資料
| 型號(hào)： | STPCE1DDBC |
| 英文描述： | Microprocessor |
| 中文描述： | 微處理器 |
| 文件頁(yè)數(shù)： | 56/87頁(yè) |
| 文件大?。?/td> | 1356K |
| 代理商： | STPCE1DDBC |
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MECHANICAL DATA
56/87
Release 1.3 - January 29, 2002
5.2. 388-PIN PACKAGE THERMAL DATA
The 388-pin PBGA package has a Power
Dissipation Capability of 4.5W. This increases to
6W when used with a Heatsink.
The structure in shown in
Figure 5-4
.
Thermal dissipation options are illustrated in
Figure 5-5
and
Figure 5-6
.
Figure 5-4. 388-Pin PBGA structure
Thermal balls
Power & Ground layers
Signal layers
Figure 5-5. Thermal Dissipation Without Heatsink
Ambient
Board
Case
Junction
Board
Ambient
Ambient
Case
125
Junction
Board
Rca
Rjc
Rjb
Rba
6
6
8.5
Rja = 13 °C/W
Airflow = 0
Board temperature taken at the centrecentre ba
Board dimensions:
- 10.2 cm x 12.7 cm
- 4 layers (2 for signals, 1 GND, 1VCC)
The PBGA is centred on board
There are no other devices
1 via pad per ground ball (8-mil wire)
40% copper on signal layers
Copper thickness:
- 17μm for internal layers
- 34μm for external layers
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| STPCE1DDBI | Microprocessor |
| STPCE1HDC | Microprocessor |
| STPCELITE | X86 Core General Purpose PC Compatible System - on - Chip |
| STPCE1EDBI | X86 Core General Purpose PC Compatible System - on - Chip |
| STPCE1EEBC | X86 Core General Purpose PC Compatible System - on - Chip |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| STPCE1DDBI | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor |
| STPCE1EDBC | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:X86 Core General Purpose PC Compatible System - on - Chip |
| STPCE1EDBI | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:X86 Core General Purpose PC Compatible System - on - Chip |
| STPCE1EEBC | 制造商:STMicroelectronics 功能描述:X86 CORE PC COMPATIBLE INFORMATION APPLIANCE SYSTEM-ON-CHIP - Bulk |
| STPCE1EEBI | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:X86 Core General Purpose PC Compatible System - on - Chip |
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