參數(shù)資料
型號: STK672-010
廠商: Sanyo Electric Co.,Ltd.
英文描述: Unipolar Fixed-Current Chopper (separate excitation) Type 1.7 A Output Current Stepping Motor Driver with Built-in 4-Phase Distribution Controller(單極性固定電流斬波型輸出電流1.7A步進式馬達驅(qū)動器(帶內(nèi)置式4相位分配控制器))
中文描述: 單極固定電流斬波(單獨激發(fā))類型1.7 A輸出電流步進電機驅(qū)動器,內(nèi)置4相分布控制器(單極性固定電流斬波型輸出電流1.7A步進式馬達驅(qū)動器(帶內(nèi)置式4相位分配控制器))
文件頁數(shù): 13/17頁
文件大?。?/td> 325K
代理商: STK672-010
<Oscillator Frequency Setting>
The separate excitation chopping frequency f can be derived from t
ON
and t
OFF
as follows.
V
L
V
H
t
ON
= –CR
1
×
In
............................................................................................................................................. (4)
t
OFF
= –C
×
×
In 1 –
.......................................................................................... (5)
Therefore, the separate excitation chopping frequency f is given by the following formula.
f =
[Hz] ............................................................................................................................................. (6)
Values of R1 = 2.4 k
and C = 7500 pF are appropriate to achieve the recommended time constant.
Thermal Design
The size of the heat sink required for this hybrid IC is determined by the motor output current I
OH
(A), the motor’s
electrical characteristics, the excitation mode, and the clock frequency fclock (Hz) of the excitation input signal. The
thermal resistance of the required heat sink can be derived from the following formula.
θ
c-a =
[°C/W] .............................................................................................................................. (7)
Tc max = The hybrid IC case temperature (°C)
Ta
= Set internal temperature (°C)
Pd
= The hybrid IC average internal power dissipation (W)
The heat sink thermal resistance
θ
c-a can be derived from the average power dissipation shown in Figure 14. Then the heat
sink area can be derived from Figure 15. Note that the ambient temperature is influenced significantly by the air circulation
conditions within the set. Therefore, the heat sink size must be determined so that back surface (the aluminum plate side) of
the hybrid IC never exceeds Tc max (105°C) under any condition in the mounted state within the end product.
Tc max – Ta
Pd
1
t
ON
+ t
OFF
Rx
×
V
CC
2
Rx
×
R
1
0.33
×
V
CC
2
Rx
×
R
1
R
1
+ Rx
No. 4927-13/17
STK672-010
Fig. 12 R/C Waveform
Fig. 13 R/C Pin Peripheral Circuit
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