參數(shù)資料
型號: STD3NK60ZT4
廠商: 意法半導體
英文描述: N-CHANNEL 600V - 3.3ohm - 2.4A TO-220/FP/D2PAK/DPAK/IPAK Zener-Protected SuperMESH⑩Power MOSFET
中文描述: N溝道600V的- 3.3ohm - 2.4? TO-220/FP/D2PAK/DPAK/IPAK齊保護的SuperMESH⑩功率MOSFET
文件頁數(shù): 2/15頁
文件大?。?/td> 755K
代理商: STD3NK60ZT4
STP3NK60Z /FP - STB3NK60Z - STD3NK60Z - STD3NK60Z-1
2/15
ABSOLUTE MAXIMUM RATINGS
Symbol
( ) Pulse width limited by safe operating area
(1) I
SD
2.4 A, di/dt
200A/μs, V
DD
V
(BR)DSS
, T
j
T
JMAX.
(*) Limited only by maximum temperature allowed
THERMAL DATA
AVALANCHE CHARACTERISTICS
Symbol
I
AR
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T
j
max)
E
AS
Single Pulse Avalanche Energy
(starting T
j
= 25 °C, I
D
= I
AR
, V
DD
= 50 V)
GATE-SOURCE ZENER DIODE
Symbol
BV
GSO
Gate-Source Breakdown
Voltage
PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES
The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s
ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be
applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and
cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the
usage of external components.
Parameter
Value
Unit
STP3NK60Z
STB3NK60Z
STP3NK60ZFP
STD3NK60Z
STD3NK60Z-1
V
DS
V
DGR
V
GS
I
D
I
D
I
DM
( )
P
TOT
Drain-source Voltage (V
GS
= 0)
Drain-gate Voltage (R
GS
= 20 k
)
600
V
600
V
Gate- source Voltage
± 30
V
Drain Current (continuous) at T
C
= 25°C
Drain Current (continuous) at T
C
= 100°C
Drain Current (pulsed)
2.4
2.4 (*)
2.4 (*)
A
1.51
1.51 (*)
1.51 (*)
A
9.6
9.6 (*)
9.6 (*)
A
Total Dissipation at T
C
= 25°C
Derating Factor
Gate source ESD(HBM-C=100pF, R=1.5K
)
Peak Diode Recovery voltage slope
45
20
45
W
0.36
0.16
0.36
W/°C
V
ESD(G-S)
dv/dt (1)
V
ISO
T
j
T
stg
2100
V
4.5
V/ns
Insulation Withstand Voltage (DC)
-
2500
-
V
Operating Junction Temperature
Storage Temperature
-55 to 150
°C
TO-220
D
2
PAK
2.78
TO-220FP
DPAK
IPAK
Rthj-case
Rthj-amb
T
l
Thermal Resistance Junction-case Max
Thermal Resistance Junction-ambient Max
6.25
2.78
100
°C/W
°C/W
°C
62.5
Maximum Lead Temperature For Soldering Purpose
300
Parameter
Max Value
2.4
Unit
A
150
mJ
Parameter
Test Conditions
Igs=± 1mA (Open Drain)
Min.
30
Typ.
Max.
Unit
V
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