
1.2 Features
Introduction
STD150
1-2
Samsung ASIC
1.2
Features
Robust 1.2V standard cell library including mircro processor, DSP, and analog
cores.
- 0.13
μ
m CMOS process technology with optional 7 metal layers.
- High gate count design of up to 46 million gates with up to 85% utilization for
7 metal layers.
- Typical 2 input NAND gate delay of 52ps with a fanout of 2.
- Characterized to industrial (-40C to 85C) and commercial (0C to 70C)
temperature ranges.
Robust Digital Cores
- Hard macro cells - ARM7TDMI, ARM9TDMI, ARM920T, ARM940T,
ARM946E-S, ARM926E-JS, Teak, and TeakLite.
- ARM embedded trace macro cells - ETM7 and ETM9
- Soft macro cells - USB1.1, IrDA, 16C450 and 16C550 UART, Fast Ether
net MAC, P1394a LINK, IEEE1284, PCI controller,
PCMCIA controller.
Ultra Low Voltage (1.2V) and High Resolution (3.3V) Analog Cores
- Analog core supply voltages (
±
5%) -1.2V, 2.5V, and 3.3V.
- ADC: 8 bit (250kHz, 1.2V and 125MHz, 3.3V), 10 bit (30MHz, 1.2V), and
12 bit (250kHz-10MHz, 3.3V)
- DAC: 10 bit (80MHz, 1.2V), 12 bit (2MHz - 300MHz, 3.3V)
- CODEC: 14 bit Sigma-Delta (8kHz - 11kHz, 2.5V)
- PLL: 1.2V FSPLL (25MHz - 300MHz and 100MHz - 500MHz), SSCG (1.2V,
200MHz)
Fully User Configurable SRAMs and ROMs
- Suitable for high density or low power memory applications
- Single port (1RW, 1R), dual port (2RW), and multi port (1R1W , 2R1W,
2R2W)
- Bit-write capability
- 2 bank architecture available
- Zero hold time for data in, address and control pins
- Flexible aspect ratio
- Up to 256K-bit single port(1RW) SRAM
- Up to 1M-bit single port(1RW) repairable SRAM
- Up to 128K-bit dual port(2RW) SRAM
- Up to 1M-bit single port(1R) via-1 programmable ROM
- Up to 16K-bit multi port(1R1W, 2R1W, 2R2W) register files
- Up to 32K-bit CAM with binary (On-demand)
- Up to 64K-bit FIFO (On-demand)
- Up to 4M-bit single port(1RW) SRAM with burst operations (On-demand)
- Up to 4M-bit single port(1R) via-1 programmable ROM (On-demand)
Full Compliment of I/O Cells
- 2.5V/3.3V drive and 5.0V tolerant I/Os
- 3 levels (high, medium, and no) of slew rate control
- Minimum wire bonded pad pitch
- 60
μ
m single in line I/Os
- 30
μ
m staggered I/Os
- Drive capabilities
- Up to 12mA for drive I/Os
- Up to 6mA for 5V tolerant I/Os