參數(shù)資料
型號(hào)： SI2439-A-FM
廠商： Silicon Laboratories Inc
文件頁數(shù)： 62/70頁
文件大?。?/td> 0K
描述： IC ISOMODEM 33.6KBPS 38-QFN
標(biāo)準(zhǔn)包裝： 364
系列： *
Si2494/39
Rev. 1.0
65
12. 38-Pin QFN Land Pattern
Figure 17 shows the recommended land pattern for the Si2494/39 QFN-38 package. Table 19 lists the values for
the dimensions shown in the illustration.
Figure 17. QFN-38 Land Pattern Drawing
Table 19. QFN-38 PCB Land Pattern Dimensions
Dimension
Feature
Min
Max
C1
Pad column spacing
4.70
4.80
C2
Pad row spacing
6.70
6.80
E
Pad pitch
0.50 BSC
X1
Pin pad width
0.20
0.30
X2
Thermal pad width
3.20
3.30
Y1
Pin pad width
0.80
0.90
Y2
Thermal pad length
5.20
5.30
Notes:
General
1.
All dimensions shown are in millimeters (mm) unless otherwise noted.
2.
This Land Pattern Design is based on the IPC-7351 guidelines.
Solder Mask Design
1.
All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is
to be 60
m minimum, all the way around the pad.
Stencil Design
1.
A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder
paste release.
2.
The stencil thickness should be 0.125 mm (5 mils).
3.
The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads
4.
A 3x5 array of 0.90 mm square openings on 1.10 mm pitch should be used for the center ground pad.
Card Assembly
1.
A No-Clean, Type-3 solder paste is recommended.
2.
The recommended card reflow profile is per the JEDEC/IPEC J-STD-020 specification for Small Body Components.
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