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參數(shù)資料
| 型號(hào)： | SC16IS762IPW |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 連接器件 |
| 英文描述： | Dual UART with I2C-bus-SPI interface, 64 bytes of transmit and receive FIFOs, IrDA SIR built-in support |
| 封裝： | SC16IS752IBS<SOT617-1 (HVQFN32)|<<http://www.nxp.com/packages/SOT617-1.html<1<Always Pb-free,;SC16IS752IBS<SOT617-1 (HVQFN32)|<<http://www.nxp.com/packages/SOT617-1.html& |
| 文件頁數(shù)： | 54/60頁 |
| 文件大?。?/td> | 356K |
| 代理商： | SC16IS762IPW |
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SC16IS752_SC16IS762
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 8 — 1 September 2011
54 of 60
NXP Semiconductors
SC16IS752; SC16IS762
Dual UART with I
2
C-bus/SPI interface, 64-byte FIFOs, IrDA SIR
16. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling ensure that the appropriate precautions are taken as
described in
JESD625-A
or equivalent standards.
17. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note
AN10365 “Surface mount reflow
soldering description”
.
17.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
17.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
17.3 Wave soldering
Key characteristics in wave soldering are:
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SC16IS762IPW,112 | 功能描述:UART 接口集成電路 DUAL UART 64BYTE RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16IS762IPW,128 | 功能描述:UART 接口集成電路 I2C/SPI-UARTBRIDGE RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16IS762IPW112 | 制造商:NXP Semiconductors 功能描述:IC DUAL UART FIFO 5MBPS 3.6V TSSOP28 |
| SC16IS762IPW-F | 功能描述:UART 接口集成電路 I2C/SPI-UARTBRIDGE W/IRDA AND GPIO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16IS762IPW-S | 功能描述:IC UART DUAL I2C/SPI 28-TSSOP RoHS:是 類別:集成電路 (IC) >> 接口 - UART（通用異步接收器/發(fā)送器） 系列:- 標(biāo)準(zhǔn)包裝:250 系列:- 特點(diǎn):* 通道數(shù):2，DUART FIFO's:16 字節(jié) 規(guī)程:RS232，RS485 電源電壓:2.25 V ~ 5.5 V 帶并行端口:- 帶自動(dòng)流量控制功能:是 帶IrDA 編碼器/解碼器:是 帶故障啟動(dòng)位檢測功能:是 帶調(diào)制解調(diào)器控制功能:是 帶CMOS:是 安裝類型:表面貼裝 封裝/外殼:48-TQFP 供應(yīng)商設(shè)備封裝:48-TQFP（7x7） 包裝:托盤 其它名稱:XR16L2551IM-F-ND |
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