參數(shù)資料
型號： SC16C754BIB80
廠商： NXP Semiconductors N.V.
元件分類： 收發(fā)器
英文描述： 5 V, 3.3 V and 2.5 V quad UART, 5 Mbit-s (max.) with 64-byte FIFOs
封裝： SC16C754BIA68<SOT188-2 (PLCC68)|<<http://www.nxp.com/packages/SOT188-2.html<1<Always Pb-free,;SC16C754BIA68<SOT188-2 (PLCC68)|<<http://www.nxp.com/packages/SOT188-2.html&
文件頁數(shù)： 47/51頁
文件大?。?/td> 253K
代理商： SC16C754BIB80
SC16C754B_4
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 04 — 6 October 2008
47 of 51
NXP Semiconductors
SC16C754B
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs
13.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
Figure 28
) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 27
and
28
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 28
.
Table 27.
Package thickness (mm)
SnPb eutectic process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
235
220
≥
350
220
220
< 2.5
≥
2.5
Table 28.
Package thickness (mm)
Lead-free process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2000
260
250
245
> 2000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
相關(guān)PDF資料
PDF描述
SC16C754BIBM 5 V, 3.3 V and 2.5 V quad UART, 5 Mbit-s (max.) with 64-byte FIFOs
SC16C850IBS 2.5 V to 3.3 V UART, 5 Mbit-s (max.) with 128-byte FIFOs, infrared (IrDA), and 16 mode or 68 mode parallel bus interface
SC16C850IET 2.5 V to 3.3 V UART, 5 Mbit-s (max.) with 128-byte FIFOs, infrared (IrDA), and 16 mode or 68 mode parallel bus interface
SC16C850LIB 1.8 V single UART, 5 Mbit-s (max.) with 128-byte FIFOs, infrared (IrDA) and 16 mode or 68 mode parallel bus interface
SC16C850LIBS 1.8 V single UART, 5 Mbit-s (max.) with 128-byte FIFOs, infrared (IrDA) and 16 mode or 68 mode parallel bus interface
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SC16C754BIB80,528 功能描述:UART 接口集成電路 16CB 2.5V-5V 4CH RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C754BIB80,551 功能描述:UART 接口集成電路 16CB 2.5V-5V 4CH UART 64B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C754BIB80,557 功能描述:UART 接口集成電路 4CH. UART 64B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C754BIB80-T 功能描述:UART 接口集成電路 16CB 2.5V-5V 4CH UART 64B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C754BIBM 功能描述:UART 接口集成電路 16CB 2.5V-5V 4CH UART 64B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
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