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參數(shù)資料
| 型號： | SC16C654BIEC |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.), with 64-byte FIFOs and infrared (IrDA) encoder/decoder |
| 中文描述： | 4 CHANNEL(S), 5M bps, SERIAL COMM CONTROLLER, PBGA64 |
| 封裝： | 6 X 6 MM, 1.05 MM HEIGHT, PLASTIC, SOT-686-1, LFBGA-64 |
| 文件頁數(shù)： | 50/52頁 |
| 文件大?。?/td> | 647K |
| 代理商： | SC16C654BIEC |
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Philips Semiconductors
SC16C654/654D
Quad UART with 64-byte FIFO and infrared (IrDA) encoder/decoder
Product data
Rev. 04 — 19 June 2003
50 of 52
9397 750 11617
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[4]
[5]
[6]
[7]
13. Revision history
Table 30:
Rev Date
04
Revision history
CPCN
20030619
Description
Product data (9397 750 11617); ECN 853-2377 30029 of 16 June 2003.
Modifications:
Figure 6 “Crystal oscillator connection.” on page 16
: changed capacitors’ values and added
connection with resistor.
Table 27 “DC electrical characteristics” on page 34
: I
CCsleep
: change all values to 1 mA nom.
Table 28 “AC electrical characteristics”
: add
Table note 2
, its reference to parameter ‘IOW
strobe width’, and re-number subsequent note.
Product data (9397 750 11373); ECN 853-2377 29798 of 11 April 2003.
Product data (9397 750 10985); ECN 853-2377 29458 of 03 February 2003.
Product data (9397 750 09393); ECN 853-2377 28891 of 10 September 2002.
-
03
02
01
20030415
20030313
20020910
-
-
-
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SC16C654BIEC,528 | 功能描述:UART 接口集成電路 16CB 2.5V-5V 4CH RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16C654BIEC,551 | 功能描述:UART 接口集成電路 4CH. UART 64B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16C654BIEC,557 | 功能描述:UART 接口集成電路 16CB 2.5V-5V 4CH RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16C654BIEC-F | 功能描述:UART 接口集成電路 16CB 2.5V-5V 4CH UART 64B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16C654BIEC-S | 功能描述:UART 接口集成電路 4CH. UART 64B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
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