參數(shù)資料
型號(hào)： SC16C550BIA44
廠商： NXP Semiconductors N.V.
元件分類： 收發(fā)器
英文描述： 5 V, 3.3 V and 2.5 V UART with 16-byte FIFOs
封裝： SC16C550BIA44<SOT187-2 (PLCC44)|<<http://www.nxp.com/packages/SOT187-2.html<1<week 51, 2004,;SC16C550BIA44<SOT187-2 (PLCC44)|<<http://www.nxp.com/packages/SOT187-2.html&l
文件頁(yè)數(shù)： 43/48頁(yè)
文件大?。?/td> 240K
代理商： SC16C550BIA44
SC16C550B_5
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 1 October 2008
43 of 48
NXP Semiconductors
SC16C550B
5 V, 3.3 V and 2.5 V UART with 16-byte FIFOs
12.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
Figure 28
) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 27
and
28
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 28
.
Table 27.
Package thickness (mm)
SnPb eutectic process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
235
220
≥
350
220
220
< 2.5
≥
2.5
Table 28.
Package thickness (mm)
Lead-free process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2000
260
250
245
> 2000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SC16C550BIA44,512 功能描述:UART 接口集成電路 16CB 2.5V-5V 1CH RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C550BIA44,518 功能描述:UART 接口集成電路 1CH. UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C550BIA44,529 功能描述:UART 接口集成電路 16CB 2.5V-5V 1CH RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C550BIA44512 制造商:NXP Semiconductors 功能描述:IC SINGLE UART FIFO 3MBPS 5.5V LCC44
SC16C550BIA44-S 功能描述:UART 接口集成電路 16CB 2.5V-5V 1CH UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
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