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參數(shù)資料
| 型號： | SC16C2550IN40,112 |
| 廠商： | NXP Semiconductors |
| 文件頁數(shù)： | 38/46頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC UART DUAL W/FIFO 40-DIP |
| 標準包裝： | 9 |
| 特點： | 2 通道 |
| 通道數(shù)： | 2，DUART |
| FIFO's： | 16 字節(jié) |
| 電源電壓： | 2.5V，3.3V，5V |
| 帶自動流量控制功能： | 是 |
| 帶IrDA 編碼器/解碼器： | 是 |
| 帶故障啟動位檢測功能： | 是 |
| 帶調(diào)制解調(diào)器控制功能： | 是 |
| 帶CMOS： | 是 |
| 安裝類型： | 通孔 |
| 封裝/外殼： | 40-DIP（0.600"，15.24mm） |
| 供應商設備封裝： | 40-DIP |
| 包裝： | 管件 |
| 其它名稱： | 568-3262-5 935270024112 SC16C2550IN40 |
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Philips Semiconductors
SC16C2550
Dual UART with 16 bytes of transmit and receive FIFOs and IrDA
encoder/decoder
Product data
Rev. 03 — 19 June 2003
43 of 46
9397 750 11621
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
– for packages with a thickness
≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a volume
≥ 350 mm3 so called
thick/large packages.
below 235
°C (SnPb process) or below 260 °C (Pb-free process) for packages with
a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all
times.
12.3.2
Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45
° angle
to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be xed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250
°C or
265
°C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated ux will eliminate the need for removal of corrosive residues in
most applications.
12.3.3
Manual soldering
Fix the component by rst soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the at part of the lead. Contact time
must be limited to 10 seconds at up to 300
°C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320
°C.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SC16C2552 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Dual UART with 16-byte transmit and receive FIFOs |
| SC16C2552B | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs |
| SC16C2552BIA44 | 功能描述:UART 接口集成電路 16CB 2.5V-5V 2CH UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16C2552BIA44,512 | 功能描述:UART 接口集成電路 16CB 2.5V-5V 2CH RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16C2552BIA44,518 | 功能描述:UART 接口集成電路 16CB 2.5V-5V 2CH RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
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