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參數(shù)資料
| 型號： | SA58643 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Single-Pole Double-Throw (SPDT) switch |
| 中文描述： | 單刀雙擲（SPDT）開關 |
| 文件頁數(shù)： | 13/16頁 |
| 文件大?。?/td> | 153K |
| 代理商： | SA58643 |
SA58643_1
NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 20 November 2006
13 of 16
NXP Semiconductors
SA58643
Single-Pole Double-Throw (SPDT) switch
15.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
Figure 25
) than a PbSn process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 7
and
8
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 25
.
Table 7.
Package thickness (mm)
SnPb eutectic process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
235
220
≥
350
220
220
< 2.5
≥
2.5
Table 8.
Package thickness (mm)
Lead-free process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2000
260
250
245
> 2000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| SA58643DP | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Single-Pole Double-Throw (SPDT) switch |
| SA58643DP,118 | 功能描述:RF 開關 IC SPDT SWITCH RoHS:否 制造商:M/A-COM Technology Solutions 開關數(shù)量:Single 開關配置:SPDT 介入損耗:0.6 dB 截止隔離（典型值）:43 dB 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:PQFN-16 封裝:Reel |
| SA58646 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:UHF 900 MHz transceiver IC |
| SA58646BD | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:UHF 900 MHz transceiver IC |
| SA58646BD,118 | 功能描述:射頻接收器 UHF/9MHZ TRANSCEIVER RoHS:否 制造商:Skyworks Solutions, Inc. 類型:GPS Receiver 封裝 / 箱體:QFN-24 工作頻率:4.092 MHz 工作電源電壓:3.3 V 封裝:Reel |
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