Philips Semiconductors
Product specification
SA1620
Low voltage GSM front-end transceiver
1997 May 22
4
PIN DESCRIPTIONS
Pin No.
Pin Name
Description
DC Regulators
15
GND1
Ground of regulator supply
18
GND2
Ground of regulator supply
21
GND3
Ground of regulator supply
26
CON2
Control 2, voltage select for regulator 1
and 2
29
CON1
Control 1, voltage select for regulator 1
and 2
30
GNDREG2
Ground of regulator 2
31
VREG2
Output of regulator 2
32
VREG2F2
Feedback of regulator 2
33
VREG1
Output of regulator 1
34
GNDREG1
Ground of regulator 1
35
PON
Power-on input of regulators
36
V
BATT
Input of regulator 1 and 2
Rx Path
1
V
CC
L2
IN2
Positive supply for LNA2
2
Input LNA2
3
GNDL2
Ground L2 for LNA2
4
GNDL2A
Ground L2A for LNA2
5
OUT2
Output LNA2
6
B
Attenuation select B for LNA1 and LNA2
7
A
Attenuation select A for LNA1 and LNA2
8
INM
RF input for Rx mixer, open emitter
9
INMX
Inverse RF input for Rx mixer, open
emitter
10
COMP2
Capacitor for bias stabilization
11
COMP1
Capacitor for bias stabilization
12
V
CC
BM
V
CC
for Rx Bias and Rx mixer
Pin No.
Pin Name
Description
13
GNDBM
Ground for Rx Bias and Rx mixer
14
PONRx
Power on input for Rx bias supply
16
RxIF
IF output, open collector
17
RxIFX
Inverse IF output, open collector
44
IN1
Input to LNA1
45
GNDL1
Ground L1 for LNA1
46
GNDL1A
Ground L1A for LNA1
47
OUT1
Output LNA1
48
V
CC
L1
Positive supply for LNA1
Tx Path
19
TxIF
IF input for Tx
20
TxIFX
Inverse IF input for Tx
22
V
CC
Tx1
GNDTx1
Positive supply for Tx input
23
Ground for Tx input
24
V
CC
Tx2
GNDTx2
Positive supply for LO and Tx input
25
Ground for LO and Tx input
38
PDTx
Power down Tx input
39
GNDTx4
Ground for Tx output
40
TxOX
Inverse Tx output, open collector
41
TxO
Tx output, open collector
42
GNDTx3
Ground 1 for Tx output side
43
RETx
Reference resistor for Tx output current
Elements for Tx and Rx Path
27
LO IN
Input for Local Oscillator signal
28
LO INX
Inverse input for LO or AC ground
37
PONBUF
Power on first stage LO input buffer and
bias
NOTES:
1. Device is ESD sensitive. There are no ESD protection diodes at Pins 16, 17, 40 and 41. Thus, open-collector outputs may have increased
DC voltage or higher AC peak voltage.
2. Pins 15, 18 and 21 are connected to each other and to a separate ground in REG1 and REG2.
3. Pins 23, 25, 42 and 39 are connected to each other and to the Tx path, LO buffer and associated bias supplies.
4. Pins 22 and 24 are connected to each other providing a sense input. They are also connected to the Tx path, LO buffer and associated bias
supplies.
5. Pins 30 and 34 are not internally connected. They must be connected to external grounds.
6. Pins 48, 1, and 12 are not internally connected and have no ESD protection diodes between them. Power may be saved by connecting
V
CC
L1 and IN1 or V
CC
L2 and IN2 to ground if LNA1 or LNA2 is not needed.