| 型號: | S73WS256NEEBFWTB3 | 
| 廠商: | SPANSION LLC | 
| 元件分類: | 存儲器 | 
| 英文描述: | Stacked Multi-Chip Product (MCP) | 
| 中文描述: | SPECIALTY MEMORY CIRCUIT, PBGA137 | 
| 封裝: | 9 X 12 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-137 | 
| 文件頁數(shù): | 1/251頁 | 
| 文件大?。?/td> | 3747K | 
| 代理商: | S73WS256NEEBFWTB3 | 

| 相關(guān)PDF資料 | PDF描述 | 
|---|---|
| S73WS256NDEBFWT70 | Stacked Multi-Chip Product (MCP) | 
| S73WS256NDEBFWT72 | Stacked Multi-Chip Product (MCP) | 
| S73WS256NDEBFWT73 | Stacked Multi-Chip Product (MCP) | 
| S73WS256NDEBFWTB0 | Stacked Multi-Chip Product (MCP) | 
| S73WS256NDEBFWTB2 | Stacked Multi-Chip Product (MCP) | 
| 相關(guān)代理商/技術(shù)參數(shù) | 參數(shù)描述 | 
|---|---|
| S73WS-P | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) | 
| S-73X | 制造商:Triad Magnetics 功能描述: | 
| S74_MPSL51 WAF | 制造商:Fairchild Semiconductor Corporation 功能描述: | 
| S-740 | 制造商:ARW 功能描述: | 
| S741 | 制造商:Hubbell Premise Wiring 功能描述: |