型號: | S73WS256NDEBFWT73 |
廠商: | SPANSION LLC |
元件分類: | 存儲(chǔ)器 |
英文描述: | Stacked Multi-Chip Product (MCP) |
中文描述: | SPECIALTY MEMORY CIRCUIT, PBGA137 |
封裝: | 9 X 12 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-137 |
文件頁數(shù): | 1/251頁 |
文件大小: | 3747K |
代理商: | S73WS256NDEBFWT73 |
相關(guān)PDF資料 |
PDF描述 |
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S73WS256NDEBFWTB0 | Stacked Multi-Chip Product (MCP) |
S73WS256NDEBFWTB2 | Stacked Multi-Chip Product (MCP) |
S73WS256NDEBFWTB3 | Stacked Multi-Chip Product (MCP) |
S73WS256NEEBAWA70 | Stacked Multi-Chip Product (MCP) |
S73WS256NEEBAWA72 | Stacked Multi-Chip Product (MCP) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
---|---|
S73WS256NDEBFWTB0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
S73WS256NDEBFWTB2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
S73WS256NDEBFWTB3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
S73WS256NEEBAWA70 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
S73WS256NEEBAWA72 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |