參數(shù)資料
型號(hào)： S72WS-N
廠商： Spansion Inc.
英文描述： Based MCP/PoP Products
中文描述： 基于MCP的/流行產(chǎn)品
文件頁數(shù)： 24/30頁
文件大?。?/td> 810K
代理商： S72WS-N
22
S72WS-N Based MCP/PoP Products
S72WS-N_00_A8 June 1, 2006
A d v a n c e I n f o r m a t i o n
5.3
FVD137—137-ball Fine-Pitch Ball Grid Array (FBGA) 11 x 13 mm Package
3522 \ 16-038.21 \ 09.29.05
PACKAGE
FVD 137
JEDEC
N/A
D x E
13.00 mm x 11.00 mm
PACKAGE
NOTE
SYMBOL
MIN
NOM
MAX
A
---
---
1.40
PROFILE
A1
0.10
---
---
BALL HEIGHT
A2
1.09
---
1.24
BODY THICKNESS
D
13.00 BSC.
BODY SIZE
E
11.00 BSC.
BODY SIZE
D1
10.40 BSC.
MATRIX FOOTPRINT
E1
7.20 BSC.
MATRIX FOOTPRINT
MD
14
MATRIX SIZE D DIRECTION
ME
10
MATRIX SIZE E DIRECTION
n
137
BALL COUNT
b
0.35
0.40
0.45
BALL DIAMETER
eE
0.80 BSC.
BALL PITCH
eD
0.80 BSC
BALL PITCH
SD SE
0.40 BSC.
SOLDER BALL PLACEMENT
G5,H5,H6
DEPOPULATED SOLDER BALLS
NOTES:
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JEP95, SECTION
4.3, SPP-010.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
9
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
0.08
C
C
6
b
0.15 M C
C
A
B
M
SIDE VIEW
137X
0.08
7
SE
E1
D1
10
9
8
7
6
5
4
3
2
1
eE
eD
A
CORNER
PIN A1
C
D
E
F
G
H
J
K
L
M
N
7
SD
BOTTOM VIEW
P
C
B
A
D
E
0.15
(2X)
C
B
C
0.15
(2X)
9
TOP VIEW
PIN A1
CORNER
A2
A
INDEX MARK
A1
0.20
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