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參數(shù)資料
| 型號： | S72WS-N |
| 廠商： | Spansion Inc. |
| 英文描述： | Based MCP/PoP Products |
| 中文描述： | 基于MCP的/流行產(chǎn)品 |
| 文件頁數(shù)： | 18/30頁 |
| 文件大小： | 810K |
| 代理商： | S72WS-N |
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S72WS-N Based MCP/PoP Products
S72WS-N_00_A8 June 1, 2006
A d v a n c e I n f o r m a t i o n
4 Ordering Information
The order number is formed by a valid combinations of the following:
S72WS
512
N
EG
BA
W
4
Y
0
PACKING TYPE
0
= Tray
2
= 7” Tape and Reel
3
= 13” Tape and Reel
MODEL NUMBER
Refer to the Valid Combinations Tables
PACKAGE MODIFIER
Refer to the Valid Combinations Tables
TEMPERATURE RANGE
W
= Wireless (-25
°
C to +85
°
C)
PACKAGE TYPE
BA
= Very-thin Fine-pitch BGA Lead (Pb)-free compliant package
BF
= Very-thin Fine-pitch BGA Lead (Pb)-free package
KF
= Fine-pitch Package-on-Package (PoP) Lead (Pb)-free
SDRAM & DATA FLASH DENSITY
EE
= 256 Mb SDRAM, 256 Mb Data Flash
DE
= 128 Mb SDRAM, 256 Mb Data Flash
D0
= 128 Mb SDRAM, No Data Flash
FG
= 512 Mb SDRAM, 1024 Mb ORNAND Flash
EG
= 256 Mb SDRAM, 1024 Mb ORNAND Flash
EF
= 256Mb SDRAM, 512Mb NAND Flash
FF
= 512Mb SDRAM, 512Mb NAND Flash
PROCESS TECHNOLOGY
N
= 110 nm, MirrorBit
TM
Technology
CODE FLASH DENSITY
256
= 256Mb
512
= 512Mb
PRODUCT FAMILY
S72WS Multi-chip Product (MCP)
1.8-volt Simultaneous Read/Write, Burst Mode Flash Memory and Mobile
SDRAM on Split Bus
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PDF描述 |
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| S72WS512PD0JF0HH2 | based MCP/PoP Products |
| S72WS512PD0HF01H0 | based MCP/PoP Products |
| S72WS512PD0HF01H2 | based MCP/PoP Products |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| S72WS-P | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:based MCP/PoP Products |
| S72XS256RE0AHBH10 | 制造商:Spansion 功能描述: |
| S-73 | 功能描述:開發(fā)板和工具包 - PIC / DSPIC PIC12F683 EMBD C DEV KIT W/PCW RoHS:否 制造商:Microchip Technology 產(chǎn)品:Starter Kits 工具用于評估:chipKIT 核心:Uno32 接口類型: 工作電源電壓: |
| S7300A0B0B0A0A0A | 制造商:Schneider Electric 功能描述:7300-I-P240-STDCOM |
| S7300A0B0B0A0N0A | 制造商:Schneider Electric 功能描述:7300-I-20MAIO PM |
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