
12
S29NS-P MirrorBit
TM
Flash Family
S29NS-P_00_A1 February 20, 2007
D a t a
S h e e t
( A d v a n c e
I n f o r m a t i o n )
VDD064—64-Ball Very Thin Fine-Pitch Ball Grid Array
Figure 4.4
VDD064—64-Ball Very Thin Fine-Pitch Ball Grid Array, S29NS512P
3533 \ 16-038.27 \ 12.13.05
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
AS NOTED).
4. e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
PACKAGE
VDD 064
JEDEC
N/A
8.00 mm x 9.20 mm NOM
PACKAGE
SYMBOL
MIN
NOM
MAX
NOTE
A
0.86
---
1.00
OVERALL THICKNESS
A1
0.20
---
---
BALL HEIGHT
A2
0.66
0.71
0.76
BODY THICKNESS
D
7.90
8.00
8.10
BODY SIZE
E
9.10
9.20
9.30
BODY SIZE
D1
4.50
BALL FOOTPRINT
E1
2.50
BALL FOOTPRINT
MD
10
ROW MATRIX SIZE D DIRECTION
ME
6
ROW MATRIX SIZE E DIRECTION
N
64
TOTAL BALL COUNT
b
0.25
0.30
0.35
BALL DIAMETER
e
0.50
BALL PITCH
SD / SE
0.25
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
INDEX MARK
A1 CORNER
SIDE VIEW
TOP VIEW
D
A
10
C
C
A
E
0.10
B
0.08
C
A2
SEATING PLANE
A1
BOTTOM VIEW
E
F
A
B
C
D
1
2
4
3
5
6
8
9
7
NF2
NF4
10
NF3
NF1
A1 CORNER
SE
7
E1
D1
0.50
e
e
SD
7
6
b
B
C
M
C
M
0.15
0.05
A
1.00