參數(shù)資料
型號(hào)： S29GL01GP12TAI022
廠商： Spansion Inc.
英文描述： 3.0 Volt-only Page Mode Flash Memory featuring 90 nm MirrorBit Process Technology
中文描述： 3.0伏只頁(yè)面模式閃存具有90納米MirrorBit工藝技術(shù)
文件頁(yè)數(shù)： 29/71頁(yè)
文件大?。?/td> 990K
代理商： S29GL01GP12TAI022
November21,2006 S29GL-P_00_A3
S29GL-P MirrorBit
TM
Flash Family
27
D a t a
S h e e t
( A d v a n c e
I n f o r m a t i o n )
7.7.4
Chip Erase Command Sequence
Chip erase is a six-bus cycle operation as indicated by
Table 12.1 on page 61
. These commands invoke the
Embedded Erase algorithm, which does not require the system to preprogram prior to erase. The Embedded
Erase algorithm automatically preprograms and verifies the entire memory for an all zero data pattern prior to
electrical erase. After a successful chip erase, all locations of the chip contain FFFFh. The system is not
required to provide any controls or timings during these operations. The “Command Definition” section in the
appendix shows the address and data requirements for the chip erase command sequence.
When the Embedded Erase algorithm is complete, that sector returns to the read mode and addresses are no
longer latched. The system can determine the status of the erase operation by using DQ7 or DQ6/DQ2. Refer
to “Write Operation Status” for information on these status bits.
The Unlock Bypass feature allows the host system to send program commands to the Flash device without
first writing unlock cycles within the command sequence. See
Section 7.7.8
for details on the Unlock Bypass
function.
Any commands written during the chip erase operation are ignored. However, note that a hardware reset
immediately terminates the erase operation. If that occurs, the chip erase command sequence should be
reinitiated once that sector has returned to reading array data, to ensure the entire array is properly erased.
Software Functions and Sample Code
The following is a C source code example of using the chip erase function. Refer to the
Spansion Low Level
Driver User’s Guide
(available on
www.spansion.com
) for general information on Spansion Flash memory
software development guidelines.
/* Example: Chip Erase Command */
/* Note: Cannot be suspended */
*( (UINT16 *)base_addr + 0x555 ) = 0x00AA; /* write unlock cycle 1 */
*( (UINT16 *)base_addr + 0x2AA ) = 0x0055; /* write unlock cycle 2 */
*( (UINT16 *)base_addr + 0x555 ) = 0x0080; /* write setup command */
*( (UINT16 *)base_addr + 0x555 ) = 0x00AA; /* write additional unlock cycle 1 */
*( (UINT16 *)base_addr + 0x2AA ) = 0x0055; /* write additional unlock cycle 2 */
*( (UINT16 *)base_addr + 0x000 ) = 0x0010; /* write chip erase command */
Table 7.9
Chip Erase
(LLD Function = lld_ChipEraseCmd)
Cycle
Description
Operation
Byte Address
Word Address
Data
1
Unlock
Write
Base + AAAh
Base + 555h
00AAh
2
Unlock
Write
Base + 555h
Base + 2AAh
0055h
3
Setup Command
Write
Base + AAAh
Base + 555h
0080h
4
Unlock
Write
Base + AAAh
Base + 555h
00AAh
5
Unlock
Write
Base + 555h
Base + 2AAh
0055h
6
Chip Erase Command
Write
Base + AAAh
Base + 555h
0010h
相關(guān)PDF資料
PDF描述
S29GL01GP12TAI023 3.0 Volt-only Page Mode Flash Memory featuring 90 nm MirrorBit Process Technology
S29GL01GP12TAIV10 3.0 Volt-only Page Mode Flash Memory featuring 90 nm MirrorBit Process Technology
S29GL01GP12TAIV12 3.0 Volt-only Page Mode Flash Memory featuring 90 nm MirrorBit Process Technology
S29GL01GP12TAIV13 3.0 Volt-only Page Mode Flash Memory featuring 90 nm MirrorBit Process Technology
S29GL01GP12TFI010 3.0 Volt-only Page Mode Flash Memory featuring 90 nm MirrorBit Process Technology
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
S29GL01GP12TAI023 制造商:SPANSION 制造商全稱:SPANSION 功能描述:3.0 Volt-only Page Mode Flash Memory featuring 90 nm MirrorBit Process Technology
S29GL01GP12TAIV10 制造商:SPANSION 制造商全稱:SPANSION 功能描述:3.0 Volt-only Page Mode Flash Memory featuring 90 nm MirrorBit Process Technology
S29GL01GP12TAIV12 制造商:SPANSION 制造商全稱:SPANSION 功能描述:3.0 Volt-only Page Mode Flash Memory featuring 90 nm MirrorBit Process Technology
S29GL01GP12TAIV13 制造商:SPANSION 制造商全稱:SPANSION 功能描述:3.0 Volt-only Page Mode Flash Memory featuring 90 nm MirrorBit Process Technology
S29GL01GP12TFI010 功能描述:閃存 1Gb 3V 120ns Parallel NOR 閃存 RoHS:否 制造商:ON Semiconductor 數(shù)據(jù)總線寬度:1 bit 存儲(chǔ)類型:Flash 存儲(chǔ)容量:2 MB 結(jié)構(gòu):256 K x 8 定時(shí)類型: 接口類型:SPI 訪問(wèn)時(shí)間: 電源電壓-最大:3.6 V 電源電壓-最小:2.3 V 最大工作電流:15 mA 工作溫度:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
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