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參數(shù)資料
| 型號： | RMPA2259 |
| 廠商： | FAIRCHILD SEMICONDUCTOR CORP |
| 元件分類： | 衰減器 |
| 英文描述： | 28 dBm WCDMA PowerEdge Power Amplifier Module |
| 中文描述： | 1920 MHz - 1980 MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER |
| 封裝： | 4 X 4 MM, 1.50 MM HEIGHT, LEAD FREE, LCC-10 |
| 文件頁數(shù)： | 10/11頁 |
| 文件大?。?/td> | 235K |
| 代理商： | RMPA2259 |
R
T
P
2005 Fairchild Semiconductor Corporation
RMPA2259 Rev. E
10
www.fairchildsemi.com
Applications Information
CAUTION: THIS IS AN ESD SENSITIVE DEVICE.
Precautions to Avoid Permanent Device Damage:
Cleanliness: Observe proper handling procedures to ensure clean devices and PCBs. Devices should remain in their
original packaging until component placement to ensure no contamination or damage to RF, DC and ground contact
areas.
Device Cleaning: Standard board cleaning techniques should not present device problems provided that the boards are
properly dried to remove solvents or water residues.
Static Sensitivity: Follow ESD precautions to protect against ESD damage:
– A properly grounded static-dissipative surface on which to place devices.
– Static-dissipative floor or mat.
– A properly grounded conductive wrist strap for each person to wear while handling devices.
General Handling: Handle the package on the top with a vacuum collet or along the edges with a sharp pair of bent
tweezers. Avoiding damaging the RF, DC, and ground contacts on the package bottom. Do not apply excessive pressure
to the top of the lid.
Device Storage: Devices are supplied in heat-sealed, moisture-barrier bags. In this condition, devices are protected and
require no special storage conditions. Once the sealed bag has been opened, devices should be stored in a dry nitrogen
environment.
Device Usage:
Fairchild recommends the following procedures prior to assembly.
Dry-bake devices at 125°C for 24 hours minimum. Note: The shipping trays cannot withstand 125°C baking temperature.
Assemble the dry-baked devices within 7 days of removal from the oven.
During the 7-day period, the devices must be stored in an environment of less than 60% relative humidity and a maximum
temperature of 30°C
If the 7-day period or the environmental conditions have been exceeded, then the dry-bake procedure must be repeated.
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PDF描述 |
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| RMPA2263 | WCDMA Power Amplifier Module 1920-1980 MHz |
| RMPA2265 | Dual Band WCDMA Power Amplifier Module 1850 to 1910 MHz and 1920 to 1980 MHz |
| RMPA2271 | WCDMA/UMTS Power Edge Power Amplifier Module with Integrated Power Detector |
| RMPA2450 | 2.4-2.5 GHz GaAs MMIC Power Amplifier |
| RMPA2451 | 2.4?2.5 GHz GaAs MMIC Power Amplifier |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| RMPA2259G | 制造商:Rochester Electronics LLC 功能描述: 制造商:Fairchild Semiconductor Corporation 功能描述: |
| RMPA2263 | 制造商:FAIRCHILD 制造商全稱:Fairchild Semiconductor 功能描述:WCDMA Power Amplifier Module 1920-1980 MHz |
| RMPA2265 | 功能描述:射頻放大器 1850-1910 MHZ/1920- 1980 MHZ DUAL BAND RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| RMPA2266 | 制造商:Rochester Electronics LLC 功能描述: 制造商:Fairchild Semiconductor Corporation 功能描述: |
| RMPA2271 | 制造商:FAIRCHILD 制造商全稱:Fairchild Semiconductor 功能描述:WCDMA/UMTS Power Edge Power Amplifier Module with Integrated Power Detector |
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