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參數(shù)資料
| 型號(hào)： | RMPA0967 |
| 廠商： | FAIRCHILD SEMICONDUCTOR CORP |
| 元件分類： | 衰減器 |
| 英文描述： | Cellular CDMA, CDMA2000-1X and WCDMA Power Edge Power Amplifier Module |
| 中文描述： | 824 MHz - 849 MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER |
| 封裝： | 3 X 3 MM, 1 MM HEIGHT, ROHS COMPLIANT, LEADLESS PACKAGE-8 |
| 文件頁(yè)數(shù)： | 7/8頁(yè) |
| 文件大小： | 142K |
| 代理商： | RMPA0967 |
7
www.fairchildsemi.com
RMPA0967 Rev. E
R
Application Information
Precautions to Avoid Permanent Device Damage:
Cleanliness: Observe proper handling procedures to ensure
clean devices and PCBs. Devices should remain in their
original packaging until component placement to ensure no
contamination or damage to RF, DC & ground contact areas.
Device Cleaning: Standard board cleaning techniques should
not present device problems provided that the boards are
properly dried to remove solvents or water residues.
Static Sensitivity: Follow ESD precautions to protect against
ESD damage:
– A properly grounded static-dissipative surface on which to
place devices.
– Static-dissipative floor or mat.
– A properly grounded conductive wrist strap for each person
to wear while handling devices.
General Handling: Handle the package on the top with a
vacuum collet or along the edges with a sharp pair of bent
tweezers. Avoiding damaging the RF, DC, & ground contacts
on the package bottom. Do not apply excessive pressure to
the top of the lid.
Device Storage: Devices are supplied in heat-sealed,
moisture-barrier bags. In this condition, devices are protected
and require no special storage conditions. Once the sealed
bag has been opened, devices should be stored in a dry
nitrogen environment.
Device Usage: Fairchild recommends the following proce-
dures prior to assembly.
– Dry-bake devices at 125°C for 24 hours minimum. Note:
The shipping trays cannot withstand 125°C baking
temperature.
– Assemble the dry-baked devices within 7 days of removal
from the oven.
– During the 7-day period, the devices must be stored in an
environment of less than 60% relative humidity and a
maximum temperature of 30°C
– If the 7-day period or the environmental conditions have
been exceeded, then the dry-bake procedure must be
repeated.
Solder Materials & Temperature Profile:
Reflow soldering is
the preferred method of SMT attachment. Hand soldering is not
recommended.
Reflow Profile
– Ramp-up: During this stage the solvents are evaporated
from the solder paste. Care should be taken to prevent
rapid oxidation (or paste slump) and solder bursts caused
by violent solvent out-gassing. A typical heating rate is 1-
2°C/sec.
– Pre-heat/soak: The soak temperature stage serves two
purposes; the flux is activated and the board and devices
achieve a uniform temperature. The recommended soak
condition is: 120-150 seconds at 150°C.
– Reflow Zone: If the temperature is too high, then devices
may be damaged by mechanical stress due to thermal
mismatch or there may be problems due to excessive
solder oxidation. Excessive time at temperature can
enhance the formation of inter-metallic compounds at the
lead/board interface and may lead to early mechanical
failure of the joint. Reflow must occur prior to the flux being
completely driven off. The duration of peak reflow
temperature should not exceed 10 seconds. Maximum
soldering temperatures should be in the range 215-220°C,
with a maximum limit of 225°C.
– Cooling Zone: Steep thermal gradients may give rise to
excessive thermal shock. However, rapid cooling promotes
a finer grain structure and a more crack-resistant solder
joint. The illustration below indicates the recommended
soldering profile.
Solder Joint Characteristics:
Proper operation of this device depends on a reliable void-free
attachment of the heatsink to the PWB. The solder joint should
be 95% void-free and be a consistent thickness.
Rework Considerations:
Rework of a device attached to a board is limited to reflow of the
solder with a heat gun. The device should not be subjected to
more than 225°C and reflow solder in the molten state for more
than 5 seconds. No more than 2 rework operations should be
performed.
Recommended Solder Reflow Profile
0
20
40
60
80
100
120
140
DEG (
°
C)
TIME (SEC)
10 SEC
183
°
C
1
°
C/SEC
1
°
C/SEC
°
C
SOAK AT 150
45 SEC (MAX)
°
C
160
180
200
220
240
0
60
120
180
240
300
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| RMPA0967_06 | 制造商:FAIRCHILD 制造商全稱:Fairchild Semiconductor 功能描述:Cellular CDMA, CDMA2000-1X and WCDMA Power Edg TM Power Amplifier Module |
| RMPA1759 | 制造商:FAIRCHILD 制造商全稱:Fairchild Semiconductor 功能描述:Korean-PCS PowerEdge Power Amplifier Module |
| RMPA1765 | 功能描述:射頻放大器 K-PCS CDMA2000-1X Pwr Edge Amp Mod RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測(cè)試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| RMPA1765_06 | 制造商:FAIRCHILD 制造商全稱:Fairchild Semiconductor 功能描述:K-PCS, CDMA, CDMA2000-1X and WCDMA Power Edge Power Amplifier Module |
| RMPA1766 | 制造商:FAIRCHILD 制造商全稱:Fairchild Semiconductor 功能描述:WCDMA Band IV Power Amplifier Module |
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