- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄374599 > RMPA0951AT (FAIRCHILD SEMICONDUCTOR CORP) 3V Cellular CDMA PowerEdge Power Amplifier Module PDF資料下載
參數(shù)資料
| 型號(hào)： | RMPA0951AT |
| 廠商： | FAIRCHILD SEMICONDUCTOR CORP |
| 元件分類： | 衰減器 |
| 英文描述： | 3V Cellular CDMA PowerEdge Power Amplifier Module |
| 中文描述： | 824 MHz - 849 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| 封裝： | 6 X 6 MM, 1.50 MM HEIGHT, LCC-7 |
| 文件頁(yè)數(shù)： | 5/11頁(yè) |
| 文件大小： | 555K |
| 代理商： | RMPA0951AT |
2004 Fairchild Semiconductor Corporation
RMPA0951AT Rev. D
R
Application Information
Precautions to Avoid Permanent Device Damage:
Cleanliness:
ensure clean devices and PCBs. Devices should remain
in their original packaging until component placement to
ensure no contamination or damage to RF, DC & ground
contact areas.
Observe proper handling procedures to
Device Cleaning:
should not present device problems provided that the
boards are properly dried to remove solvents or water
residues.
Standard board cleaning techniques
Static Sensitivity:
against ESD damage:
Follow ESD precautions to protect
– A properly grounded static-dissipative surface on
which to place devices.
– Static-dissipative floor or mat.
– A properly grounded conductive wrist strap for each
person to wear while handling devices.
–
General Handling:
with a vacuum collet or along the edges with a sharp
pair of bent tweezers. Avoiding damaging the RF, DC,
& ground contacts on the package bottom. Do not
apply excessive pressure to the top of the lid.
Handle the package on the top
–
Device Storage:
moisture-barrier bags. In this condition, devices are
protected and require no special storage conditions.
Once the sealed bag has been opened, devices
should be stored in a dry nitrogen environment.
Devices are supplied in heat-sealed,
Device Usage:
Fairchild recommends the following procedures prior to
assembly.
Dry-bake devices at 125°C for 24 hours minimum. Note:
The shipping trays cannot withstand 125°C baking
temperature.
Assemble the dry-baked devices within 7 days of
removal from the oven.
During the 7-day period, the devices must be stored in an
environment of less than 60% relative humidity and a
maximum temperature of 30°C
If the 7-day period or the environmental conditions have
been exceeded, then the dry-bake procedure must be
repeated.
Solder Materials & Temperature Profile:
Reflow soldering is the preferred method of SMT
attachment. Hand soldering is not recommended.
Reflow Profile
Ramp-up: During this stage the solvents are evaporated
from the solder paste. Care should be taken to prevent
rapid oxidation (or paste slump) and solder bursts
caused by violent solvent out-gassing. A typical heating
rate is 1 - 2°C/sec.
Pre-heat/soak: The soak temperature stage serves two
purposes; the flux is activated and the board and devices
achieve a uniform temperature. The recommended soak
condition is: 120 -150 seconds at 150°C.
Reflow Zone: If the temperature is too high, then devices
may be damaged by mechanical stress due to thermal
mismatch or there may be problems due to excessive
solder oxidation. Excessive time at temperature can
enhance the formation of inter-metallic compounds at
the lead/board interface and may lead to early
mechanical failure of the joint. Reflow must occur prior to
the flux being completely driven off. The duration of peak
reflow temperature should not exceed 10 seconds.
Maximum soldering temperatures should be in the range
215 -220°C, with a maximum limit of 225°C.
Cooling Zone: Steep thermal gradients may give rise to
excessive thermal shock. However, rapid cooling
promotes a finer grain structure and a more crack-
resistant
solder
joint.
recommended soldering profile.
Figure
4
indicates
the
Solder Joint Characteristics:
Proper operation of this device depends on a reliable void-
free attachment of the heatsink to the PWB. The solder joint
should be 95% void-free and be a consistent thickness.
Rework Considerations:
Rework of a device attached to a board is limited to reflow
of the solder with a heat gun. The device should not be
subjected to more than 225°C and reflow solder in the
molten state for more than 5 seconds. No more than 2
rework operations should be performed.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| RMPA0959 | CDMA and CDMA2000-1X PowerEdge Power Amplifier Module |
| RMPA0963 | Cellular CDMA, CDMA2000-1X and WCDMA Power Amplifier Module |
| RMPA0965 | CDMA and CDMA2000-1X PowerEdge Power Amplifier Module |
| RMPA0967 | Cellular CDMA, CDMA2000-1X and WCDMA Power Edge Power Amplifier Module |
| RMPA1759 | Korean-PCS PowerEdge Power Amplifier Module |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| RMPA0959 | 功能描述:射頻放大器 3.5V AMPS/CDMA PA Module RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測(cè)試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| RMPA0963 | 制造商:FAIRCHILD 制造商全稱:Fairchild Semiconductor 功能描述:Cellular CDMA, CDMA2000-1X and WCDMA Power Amplifier Module |
| RMPA0965 | 功能描述:射頻放大器 CDMA-CDMA2000-1X Pwr Edge Amp Mod RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測(cè)試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| RMPA0966 | 制造商:FAIRCHILD 制造商全稱:Fairchild Semiconductor 功能描述:WCDMA Band V Power Amplifier Module |
| RMPA0966_07 | 制造商:FAIRCHILD 制造商全稱:Fairchild Semiconductor 功能描述:WCDMA Band V Power Amplifier Module |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。