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參數(shù)資料
| 型號(hào)： | RMDA20420 |
| 廠(chǎng)商： | FAIRCHILD SEMICONDUCTOR CORP |
| 元件分類(lèi)： | 衰減器 |
| 英文描述： | 20-42 GHz Broadband Driver Amplifier |
| 中文描述： | 20000 MHz - 42000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| 封裝： | 1.72 X 0.76 MM, DIE |
| 文件頁(yè)數(shù)： | 3/12頁(yè) |
| 文件大?。?/td> | 819K |
| 代理商： | RMDA20420 |
2004 Fairchild Semiconductor Corporation
RMDA20420 Rev. D
R
Figure 2. Chip Layout and Bond Pad Locations
Chip Size = 0.0677" x 0.30" x 0.002" (1720μm x 760μm x 50μm)
Figure 3. Schematic of Application Circuit
Back of Chip is RF and DC Ground
0.0130"
(0.335mm)
0.004"
(0.1mm)
0.028"
(0.715mm)
0.0475"
(1.200mm)
0.0064"
(1.620mm)
0.0168"
(0.430mm)
0.0575"
(1.465mm)
0.0299"
(0.760mm)
0.0185"
(0.465mm)
0.0249"
(0.630mm)
0.013"
(0.330mm)
0.0
0.0
0.0189"
(0.480mm)
0.004"
(0.1mm)
0.0677"
(1.70mm)
0.0065"
(0.165mm)
0.0125"
(0.315mm)
0.0465"
(1.180mm)
0.0365"
(0.930mm)
0.0275"
(0.700mm)
MMIC Chip
RF IN
RF OUT
Vd1
Vg1
Vg2 alt
Vd2
Vd3
Vd4
Vg4
Vg3
Vg2
10,000 pF
10,000 pF
BOND WIRE Ls
BOND WIRE Ls
Note: For currents > 370 mA connect
all four drain pads to the 100pF
capacitor.
Note: The Input does not have a
DC blocking capacitor. It is
terminated with a 50
resistor to ground on chip and it
is isolated from any DC bias.
100 pF
100 pF
DRAIN SUPPLY (Vd)
(Connect to both Vd1 & Vd3)
GATE SUPPLY (Vg)
(VGA and/or VGB)
GROUND
(Back of Chip)
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