參數(shù)資料
型號(hào)： RK80532PC041512
英文描述： Microprocessor
中文描述： 微處理器
文件頁數(shù)： 73/86頁
文件大小： 882K
代理商： RK80532PC041512
Datasheet
73
Intel
Pentium
III Processor with 512KB L2 Cache at 1.13GHz to 1.40GHz
6.2
Thermal Specifications
This section describes the cooling requirements of the thermal cooling solution utilized by the
boxed processor.
6.2.1
Boxed Processor Cooling Requirements
The boxed processor is directly cooled with a fan heatsink. However, meeting the processor’s
temperature specification is also a function of the thermal design of the entire system and
ultimately the responsibility of the system integrator. The processor temperature specification is
found in
Section 4.1
of this document. The boxed processor fan heatsink is able to keep the
processor temperature within the specifications (see
Table 29
in
Section 4.1
) in chassis that provide
good thermal management.
For the boxed processor fan heatsink to operate properly, it is critical that the airflow provided to
the fan heatsink is unimpeded. Airflow of the fan heatsink is into the center and out of the sides of
the fan heatsink. Airspace is required around the fan to ensure that the airflow through the fan
heatsink is not blocked. Blocking the airflow to the fan heatsink reduces the cooling efficiency and
decreases fan life.
Figure 32
illustrate an acceptable airspace clearance for the fan heatsink. It is
also recommended that the air temperature entering the fan be kept below 45 degrees C. Again,
meeting the processor’s temperature specification is the responsibility of the system integrator. The
processor temperature specification is found in
Section 4.1
of this document.
6.2.2
Boxed Processor Thermal Cooling Solution Clip
The boxed processor thermal solution requires installation by a system integrator to secure the
thermal cooling solution to the processor after it is installed in the 370-pin socket ZIF socket.
Motherboards designed for use by system integrators should take care to consider the implications
of clip installation and potential scraping of the motherboard PCB underneath the 370-pin socket
attach tabs. Motherboard components should not be placed too close to the 370-pin socket attach
Figure 32. Thermal Airspace Requirement for all Boxed Intel Pentium III Processor with
512KB L2 Cache Fan Heatsinks in the PGA370 Socket
相關(guān)PDF資料
PDF描述
RK9410 TRANSISTOR | MOSFET | N-CHANNEL | 30V V(BR)DSS | 7A I(D) | SO
RKC-SERIES Interface IC
RKCB-SERIES Interface IC
RKCR-SERIES Interface IC
RKCS-SERIES Interface IC
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
RK80532PC041512 SL5YR 制造商:Intel 功能描述:
RK80532PC041512S L66R 制造商:Intel 功能描述:MPU Pentium? 4 Processor 64-Bit 0.13um 2GHz 478-Pin FCPGA2
RK80532PC041512S L6PK 制造商:Intel 功能描述:MPU Pentium? 4 Processor 64-Bit 0.13um 2GHz 478-Pin FCPGA2 制造商:Intel 功能描述:32BIT MPU 80532PC041512 2G 512 - Trays 制造商:Intel 功能描述:NORTHWOOD; MPU PENTIUM 4 NETBURST 64BIT 0.13UM 2GHZ - Trays
RK80532PC041512SL6 制造商:Intel 功能描述:ITLRK80532PC041512SL6PK MPU MM#850362
RK80532PC041512SL6PK 制造商:Intel 功能描述:ITLRK80532PC041512SL6PK MM# 850362 / 32
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*