參數(shù)資料
型號(hào)： PPC405GPR-3KB400Z
廠商： APPLIEDMICRO INC
元件分類(lèi)： 微控制器/微處理器
英文描述： Power PC 405GPr Embedded Processor
中文描述： 32-BIT, 400 MHz, RISC PROCESSOR, PBGA456
封裝： 27 X 27 MM, LEAD FREE, PLASTIC, EBGA-456
文件頁(yè)數(shù)： 38/57頁(yè)
文件大?。?/td> 614K
代理商： PPC405GPR-3KB400Z
405GPr – Power PC 405GPr Embedded Processor
38
AMCC
Revision 2.04 – September 7, 2007
Data Sheet
Absolute Maximum Ratings
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause
permanent damage to the device
Characteristic
Symbol
Value
Unit
Supply Voltage (Internal Logic)
V
DD
0 to +1.95
V
Supply Voltage (I/O Interface)
OV
DD
0 to +3.6
V
PLL Supply Voltage
AV
DD
0 to +1.95
V
Input Voltage (1.8V CMOS receivers)
V
IN
-0.6 to V
DD
+ 0.45
V
Input Voltage (3.3V LVTTL receivers)
V
IN
-0.6 to OV
DD
+ 0.6
V
Input Voltage (5.0V LVTTL receivers)
V
IN
-0.6 to OV
DD
+ 2.4
V
Storage Temperature Range
T
STG
-55 to +150
°
C
Case temperature under bias
T
C
-40 to +120
°
C
Notes:
1. All specified voltages are with respect to GND.
2. Empirical data indicates that all chip voltages should begin to ramp-up within 1 ms of each other. There should never be voltage present
at the I/O pins before OV
DD
is within operating range.
Package Thermal Specifications
The PPC405GPr is designed to operate within a case temperature range of -40°C to +85°C
3
. Thermal resistance values for the
E-PBGA packages (leaded and lead-free) in a convection environment are as follows:
Package—Thermal Resistance
Symbol
Airflow
ft/min (m/sec)
100 (0.51)
Unit
0 (0)
200 (1.02)
35mm, 456-balls—Junction-to-Case
θ
JC
θ
CA
θ
JC
θ
CA
2
2
2
°C/W
35mm, 456-balls—Case-to-Ambient
1
14
13
12
°C/W
27mm, 456-balls—Junction-to-Case
2
2
2
°C/W
27mm, 456-balls—Case-to-Ambient
1
18
16
15
°C/W
Notes:
1. For a chip mounted on a JEDEC 2S2P card without a heat sink.
2. For a chip mounted on a card with at least one signal and two power planes, the following relationships exist:
a. Case temperature, T
C
, is measured at top center of case surface with device soldered to circuit board.
b. T
A
= T
C
– P
×θ
CA
, where T
A
is ambient temperature and P is power consumption.
c. T
CMax
= T
JMax
– P
×θ
JC
, where T
JMax
is maximum junction temperature and P is power consumption.
3. 333MHz operated at 266MHz or less can operate at +105°C.
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