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參數(shù)資料
| 型號： | PowerPC 405CR |
| 廠商： | IBM Microeletronics |
| 英文描述： | 32-bit RISC Embedded Controllers(32位RISC結構嵌入式控制器) |
| 中文描述： | 32位RISC嵌入式控制器（32位的RISC結構嵌入式控制器） |
| 文件頁數(shù)： | 30/42頁 |
| 文件大?。?/td> | 565K |
| 代理商： | POWERPC 405CR |
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PowerPC 405CR Embedded Controller Data Sheet
30
Notes:
1. Case temperature, T
C
, is measured at top center of case surface with device soldered to circuit board.
2. T
A
= T
C
– P
×θ
CA
, where T
A
is ambient temperature and P is power consumption.
3. T
CMax
= T
JMax
– P
×θ
JC
, where T
JMax
is maximum junction temperature and P is power consumption.
4. The above assumes that the chip is mounted on a card with at least one signal and two power planes.
Absolute Maximum Ratings
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause
permanent damage to the device
Characteristic
Symbol
Value
Unit
Supply Voltage (Internal Logic)
V
DD
0 to 2.7
1
V
Supply Voltage (I/O Interface)
OV
DD
0 to 3.6
1
V
PLL Supply Voltage
AV
DD
V
IN
V
IN
T
STG
T
C
0 to 2.7
V
Input Voltage (3.3V LVTTL receivers)
0 to 3.6
V
Input Voltage (5.0V LVTTL receivers)
0 to 5.5
V
Storage Temperature Range
-55 to 150
°
C
Case temperature under bias
-40 to +120
°
C
Notes:
1. If OV
DD
≥
0.4V it is required that V
DD
≥
0.4V. Supply excursions not meeting this criteria must be limited to less than 25ms dura-
tion during each power up or power down event.
Package Thermal Specifications
The PPC405CR is designed to operate within a case temperature range of -40C to 120C. Thermal resistance values for
the E-PBGA package in a convection environment are as follows:
Parameter
Symbol
Airflow
ft/min (m/sec)
Unit
0 (0)
100 (0.51)
200 (1.02)
Junction-to-case thermal resistance
θ
JC
2
2
2
°C/W
Case-to-ambient thermal resistance (without heat
sink)
θ
CA
18
16
15
°C/W
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