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參數(shù)資料
| 型號(hào)： | PM908E624ACDWBR2 |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 8-BIT, FLASH, 8 MHz, MICROCONTROLLER, PDSO54 |
| 封裝： | PLASTIC, SOIC-54 |
| 文件頁(yè)數(shù)： | 16/24頁(yè) |
| 文件大?。?/td> | 718K |
| 代理商： | PM908E624ACDWBR2 |
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MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
908E624
23
PACKAGE DIMENSIONS
NOTES:
1.
ALL DIMENSIONS ARE IN MILLIMETERS.
2.
DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
3.
DATUMS B AND C TO BE DETERMINED AT THE PLANE
WHERE THE BOTTOM OF THE LEADS EXIT THE
PLASTIC BODY.
4.
THIS DIMENSION DOES NOT INCLUDE MOLD FLASH,
PROTRUSION OR GATE BURRS. MOLD FLASH,
PROTRUSION OR GATE BURRS SHALL NOT EXCEED
0.15 MM PER SIDE. THIS DIMENSION IS DETERMINED
AT THE PLANE WHERE THE BOTTOM OF THE LEADS
EXIT THE PLASTIC BODY.
5.
THIS DIMENSION DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSIONS. INTERLEAD FLASH AND
PROTRUSIONS SHALL NOT EXCEED 0.25 MM PER
SIDE. THIS DIMENSION IS DETERMINED AT THE
PLANE WHERE THEBOTTOMOF THE LEADSEXIT THE
PLASTIC BODY.
6.
THIS DIMENSION DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46
MM. DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN
PROTRUSION AND ADJACENTLEADSHALLNOTLESS
THAN 0.07 MM.
7.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
8.
THESE DIMENSIONS APPLY TO THE FLAT SECTION
OF THE LEAD BETWEEN 0.1 MM AND 0.3 MM FROM
THE LEAD TIP.
9.
THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM. THIS DIMENSION IS
DETERMINED AT THE OUTERMOST EXTREMES OF
THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE
BAR BURRS, GATE BURRS AND INTER-LEAD FLASH,
BUT INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
CL
17.8
7.4
1
27
28
54
0.10
A
2.35
SEATING
PLANE
0.9
SECTION B-B
0.65
R0.08 MIN
B
A
(0.29)
0.38
0.30
(0.25)
PLATING
BASE METAL
SECTION A-A
ROTATED 90 CLOCKWISE
°
8
0.25
0.22
9
5
0.13 M
C
AB
6
A
C
7.6
18.0
9
4
10.3
5.15
A
54X
52X
2.65
0.3 A
2X 27 TIPS
B C
BB
0.29
0.13
0.5
0 °
8 °
0 °
0.25
GAUGE PLANE
MIN
PIN 1 INDEX
DWB SUFFIX
54-TERMINAL SOIC WIDE BODY
PLASTIC PACKAGE
CASE 1365-01
ISSUE O
F
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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