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參數資料
| 型號： | PM200CLA120 |
| 廠商： | Mitsubishi Electric Corporation |
| 英文描述： | INTELLIGENT POWER MODULES FLAT-BASE TYPE INSULATED PACKAGE |
| 中文描述： | 智能功率模塊扁平性基地型絕緣包裝 |
| 文件頁數： | 3/8頁 |
| 文件大?。?/td> | 146K |
| 代理商： | PM200CLA120 |
MITSUBISHI <INTELLIGENT POWER MODULES>
PM200CLA120
FLAT-BASE TYPE
INSULATED PACKAGE
Jul. 2005
Parameter
Symbol
Supply Voltage Protected by
SC
Supply Voltage (Surge)
Storage Temperature
Isolation Voltage
Condition
V
CC(surge)
T
stg
V
iso
Ratings
V
CC(PROT)
800
1000
–
40 ~ +125
2500
Unit
V
°
C
V
rms
V
V
D
= 13.5 ~ 16.5V, Inverter Part,
T
j
= +125
°
C Start
Applied between : P-N, Surge value
60Hz, Sinusoidal, Charged part to Base, AC 1 min.
TOTAL SYSTEM
0.12
0.20
0.014
°
C/W
R
th(j-c)Q
R
th(j-c)F
R
th(c-f)
Inverter IGBT (per 1 element)
Inverter FWDi (per 1 element)
Case to fin, (per 1 module)
Thermal grease applied
(Note-1)
(Note-1)
(Note-1)
Symbol
Condition
Unit
Min.
—
—
—
—
—
—
Junction to case Thermal
Resistances
THERMAL RESISTANCES
Contact Thermal Resistance
Parameter
Limits
Typ.
Max.
(Note-1) Tc measurement point is just under the chip.
If you use this value, R
th(f-a)
should be measured just under the chips.
UP
IGBT
26.5
85.5
VP
WP
UN
VN
WN
FWDi
23.6
70.5
IGBT
76.5
85.5
FWDi
73.6
70.5
IGBT
126.5
85.5
FWDi
123.6
70.5
IGBT
23.4
24.5
FWDi
26.4
39.5
IGBT
73.4
24.5
FWDi
76.4
39.5
IGBT
123.4
24.5
FWDi
126.4
39.5
arm
axis
X
Y
2.3
2.4
3.9
2.5
0.8
1.0
3.5
1.2
1
10
Min.
—
—
—
0.5
—
—
—
—
—
—
Typ.
1.8
1.9
2.8
1.0
0.5
0.4
2.3
0.7
—
—
Max.
Collector-Emitter
Saturation Voltage
FWDi Forward Voltage
Collector-Emitter
Cutoff Current
–
I
C
= 200A, V
D
= 15V, V
CIN
= 15V
(Fig. 2)
T
j
= 25
°
C
T
j
= 125
°
C
ELECTRICAL CHARACTERISTICS
(Tj = 25
°
C, unless otherwise noted)
INVERTER PART
Parameter
Symbol
Condition
V
CE(sat)
I
CES
V
EC
t
on
t
rr
t
c(on)
t
off
t
c(off)
Limits
T
j
= 25
°
C
T
j
= 125
°
C
Switching Time
V
D
= 15V, V
CIN
= 0V
15V
V
CC
= 600V, I
C
= 200A
T
j
= 125
°
C
Inductive Load
(Fig. 3, 4)
V
CE
= V
CES
, V
CIN
= 15V
(Fig. 5)
V
D
= 15V, I
C
= 200A
V
CIN
= 0V
(Fig. 1)
V
mA
V
μ
s
Unit
7
1
6
Name
plate
side
Bottom
view
13
Y
X
(Unit : mm)
Table 1: T
C
(under the chip) measurement point is below.
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