參數(shù)資料
型號(hào): PIC12F683-E/SN
廠商: Microchip Technology
文件頁數(shù): 76/176頁
文件大小: 0K
描述: IC MCU FLASH 2KX14 8SOIC
產(chǎn)品培訓(xùn)模塊: Asynchronous Stimulus
Digi-Key 應(yīng)用說明: AN0005 PWM Example with Microchip's CCP Module
AN0005 Example Code
標(biāo)準(zhǔn)包裝: 100
系列: PIC® 12F
核心處理器: PIC
芯體尺寸: 8-位
速度: 20MHz
外圍設(shè)備: 欠壓檢測(cè)/復(fù)位,POR,PWM,WDT
輸入/輸出數(shù): 5
程序存儲(chǔ)器容量: 3.5KB(2K x 14)
程序存儲(chǔ)器類型: 閃存
EEPROM 大?。?/td> 256 x 8
RAM 容量: 128 x 8
電壓 - 電源 (Vcc/Vdd): 2 V ~ 5.5 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 4x10b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 125°C
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
包裝: 管件
配用: AC162058-ND - HEADER MPLAB ICD2 FOR PIC12F683
I3-DB12F683-ND - BOARD DAUGHTER ICEPIC3
2007 Microchip Technology Inc.
DS41211D-page 165
PIC12F683
APPENDIX A:
DATA SHEET
REVISION HISTORY
Revision A
This is a new data sheet.
Revision B
Rewrites of the Oscillator and Special Features of the
CPU sections. General corrections to Figures and
formatting.
Revision C
Revisions throughout document. Incorporated Golden
Chapters.
Revision D
Replaced Package Drawings; Revised Product ID
Section (SN package to 3.90 mm); Replaced PICmicro
with PIC; Replaced Dev Tool Section.
APPENDIX B:
MIGRATING FROM
OTHER PIC
DEVICES
This discusses some of the issues in migrating from
other PIC devices to the PIC12F683 device.
B.1
PIC16F676 to PIC12F683
TABLE B-1:
FEATURE COMPARISON
Feature
PIC16F676
PIC12F683
Max Operating
Speed
20 MHz
Max Program
Memory (Words)
1024
2048
SRAM (bytes)
64
128
A/D Resolution
10-bit
Data EEPROM
(Bytes)
128
256
Timers (8/16-bit)
1/1
2/1
Oscillator Modes
8
Brown-out Reset
Y
Internal Pull-ups
RA0/1/2/4/5
GP0/1/2/4/5,
MCLR
Interrupt-on-change
RA0/1/2/3/4/5 GP0/1/2/3/4/5
Comparator
1
ECCP
N
Ultra Low-Power
Wake-Up
NY
Extended WDT
N
Y
Software Control
Option of WDT/BOR
NY
INTOSC
Frequencies
4MHz
32 kHz-
8MHz
Clock Switching
N
Y
Note:
This device has been designed to perform
to the parameters of its data sheet. It has
been tested to an electrical specification
designed to determine its conformance
with these parameters. Due to process
differences in the manufacture of this
device, this device may have different
performance characteristics than its earlier
version. These differences may cause this
device to perform differently in your
application than the earlier version of this
device.
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