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    參數(shù)資料
    型號: PHP6NA60E
    廠商: NXP SEMICONDUCTORS
    元件分類: JFETs
    英文描述: PowerMOS transistors Low capacitance Avalanche energy rated
    中文描述: 6.5 A, 600 V, 1.2 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-220AB
    文件頁數(shù): 2/4頁
    文件大小: 21K
    代理商: PHP6NA60E
    Philips Semiconductors
    Preliminary specification
    PowerMOS transistors
    Low capacitance
    Avalanche energy rated
    PHP6NA60E
    THERMAL RESISTANCES
    SYMBOL PARAMETER
    R
    th j-mb
    Thermal resistance junction
    to mounting base
    R
    th j-a
    Thermal resistance junction
    to ambient
    CONDITIONS
    MIN.
    -
    TYP. MAX. UNIT
    -
    1
    K/W
    -
    60
    -
    K/W
    ELECTRICAL CHARACTERISTICS
    T
    j
    = 25 C unless otherwise specified
    SYMBOL PARAMETER
    V
    (BR)DSS
    Drain-source breakdown
    voltage
    V
    (BR)DSS
    / Drain-source breakdown
    T
    j
    voltage temperature
    coefficient
    R
    DS(ON)
    Drain-source on resistance
    V
    GS(TO)
    Gate threshold voltage
    g
    fs
    Forward transconductance
    I
    DSS
    Drain-source leakage current V
    DS
    = 600 V; V
    GS
    = 0 V
    CONDITIONS
    V
    GS
    = 0 V; I
    D
    = 0.25 mA
    MIN.
    600
    TYP. MAX. UNIT
    -
    -
    V
    V
    DS
    = V
    GS
    ; I
    D
    = 0.25 mA
    -
    0.1
    -
    %/K
    V
    GS
    = 10 V; I
    = 3.25 A
    V
    DS
    = V
    ; I
    D
    = 0.25 mA
    V
    DS
    = 30 V; I
    = 3.25 A
    -
    -
    1.2
    4.0
    -
    100
    500
    200
    75
    -
    -
    50
    125
    110
    30
    -
    -
    -
    V
    S
    μ
    A
    μ
    A
    nA
    nC
    nC
    nC
    ns
    ns
    ns
    ns
    nH
    nH
    nH
    2.0
    3
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    3.0
    4.5
    2
    50
    10
    -
    7
    30
    -
    -
    -
    -
    3.5
    4.5
    7.5
    V
    DS
    = 480 V; V
    GS
    = 0 V; T
    j
    = 125 C
    I
    GSS
    Q
    g(tot)
    Q
    gs
    Q
    gd
    t
    d(on)
    t
    r
    t
    d(off)
    t
    f
    L
    d
    L
    d
    L
    s
    Gate-source leakage current V
    GS
    =
    ±
    30 V; V
    DS
    = 0 V
    Total gate charge
    Gate-source charge
    Gate-drain (Miller) charge
    Turn-on delay time
    Turn-on rise time
    Turn-off delay time
    Turn-off fall time
    Internal drain inductance
    Internal drain inductance
    Internal source inductance
    I
    D
    = 3 A; V
    DD
    = 480 V; V
    GS
    = 10 V
    V
    DD
    = 300 V; R
    D
    = 47
    ;
    R
    G
    = 9.1
    Measured from tab to centre of die
    Measured from drain lead to centre of die
    Measured from source lead to source
    bond pad
    V
    GS
    = 0 V; V
    DS
    = 25 V; f = 1 MHz
    C
    iss
    C
    oss
    C
    rss
    Input capacitance
    Output capacitance
    Feedback capacitance
    -
    -
    -
    -
    1550
    -
    -
    pF
    pF
    pF
    140
    42
    SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
    T
    j
    = 25 C unless otherwise specified
    SYMBOL PARAMETER
    I
    S
    Continuous source current
    (body diode)
    I
    SM
    Pulsed source current (body
    diode)
    V
    SD
    Diode forward voltage
    t
    rr
    Reverse recovery time
    Q
    rr
    Reverse recovery charge
    CONDITIONS
    T
    mb
    = 25C
    MIN.
    -
    TYP. MAX. UNIT
    -
    6.5
    A
    T
    mb
    = 25C
    -
    -
    26
    A
    I
    S
    = 6.5 A; V
    GS
    = 0 V
    I
    S
    = 6.5 A; V
    GS
    = 0 V; dI/dt = 100 A/
    μ
    s
    -
    -
    -
    -
    1.2
    -
    -
    V
    ns
    μ
    C
    530
    6.7
    January 1998
    2
    Rev 1.000
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