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參數(shù)資料
| 型號： | pentium III |
| 廠商： | Intel Corp. |
| 英文描述： | pentium III Processor for the PGA370 Socket at 500MHz to 933MHz(工作頻率500到933兆赫茲活動帶PGA370插孔奔III處理器) |
| 中文描述： | 奔騰III處理器在500MHz到933MHz的（工作頻率500到933兆赫茲活動帶PGA370插孔奔三處理器的PGA370插座） |
| 文件頁數(shù)： | 48/78頁 |
| 文件大?。?/td> | 610K |
| 代理商： | PENTIUM III |
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48
Datasheet
Pentium
III Processor for the PGA370 Socket at 500 MHz to 933 MHz
5.0
Mechanical Specifications
The Pentium
III
processor uses a FC-PGA package technology. Mechanical specifications for the
processor are given in this section.
See
Section 1.1.1
for a complete terminology listing.
The processor utilizes a PGA370 socket for installation into the motherboard. Details on the socket
are available in the
370-Pin Socket (PGA370) Design Guidelines
.
Note:
For
Figure 19
, the following apply:
1. Unless otherwise specified, the following drawings are dimensioned in inches.
2. All dimensions provided with tolerances are guaranteed to be met for all normal production
product.
3. Figures and drawings labeled as “Reference Dimensions” are provided for informational
purposes only. Reference dimensions are extracted from the mechanical design database and
are nominal dimensions with no tolerance information applied. Reference dimensions are
NOT checked as part of the processor manufacturing. Unless noted as such, dimensions in
parentheses without tolerances are reference dimensions.
4. Drawings are not to scale.
5.1
FC-PGA Mechanical Specifications
The following figure with package dimensions is provided to aid in the design of heatsink and clip
solutions as well as demonstrate where pin-side capacitors will be located on the processor.
Table 27
includes the measurements for these dimensions in both inches and millimeters.
Figure 19. Package Dimensions
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