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參數(shù)資料
| 型號： | PCA9519 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | 4-channel level translating I2C-bus/SMBus repeater |
| 中文描述： | 4通道級翻譯I2C-bus/SMBus中繼器 |
| 文件頁數(shù)： | 13/17頁 |
| 文件大小： | 99K |
| 代理商： | PCA9519 |
PCA9519_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Objective data sheet
Rev. 01 — 22 June 2006
13 of 17
Philips Semiconductors
PCA9519
4-channel level translating I
2
C-bus/SMBus repeater
13. Soldering
13.1 Introduction to soldering surface mount packages
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
13.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow temperatures range from 215
°
C to 260
°
C depending on solder paste
material. The peak top-surface temperature of the packages should be kept below:
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
13.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
Table 6.
SnPb eutectic process - package peak reflow temperatures (from J-STD-020C
July 2004)
Package thickness
Volume mm
3
< 350
< 2.5 mm
240
°
C + 0/
5
°
C
≥
2.5 mm
225
°
C + 0/
5
°
C
Volume mm
3
≥
350
225
°
C + 0/
5
°
C
225
°
C + 0/
5
°
C
Table 7.
Pb-free process - package peak reflow temperatures (from J-STD-020CJuly
2004)
Package thickness
Volume mm
3
< 350
Volume mm
3
350 to
2000
260
°
C + 0
°
C
250
°
C + 0
°
C
245
°
C + 0
°
C
Volume mm
3
> 2000
< 1.6 mm
1.6 mm to 2.5 mm
≥
2.5 mm
260
°
C + 0
°
C
260
°
C + 0
°
C
250
°
C + 0
°
C
260
°
C + 0
°
C
245
°
C + 0
°
C
245
°
C + 0
°
C
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| PCA9519BS | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:4-channel level translating I2C-bus/SMBus repeater |
| PCA9519BS,118 | 功能描述:接口-I/O擴展器 4CH LVLTRAN RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
| PCA9519BS-T | 功能描述:接口-信號緩沖器、中繼器 4CH LVLTRAN I2C/SMBUS REPEATER RoHS:否 制造商:Texas Instruments 工作電源電壓: 工作溫度范圍: 安裝風格:SMD/SMT 封裝 / 箱體:VSSOP-8 封裝:Reel |
| PCA9519PW | 功能描述:接口-信號緩沖器、中繼器 4CH LVLTRAN I2C/SMBUS REPEATER RoHS:否 制造商:Texas Instruments 工作電源電壓: 工作溫度范圍: 安裝風格:SMD/SMT 封裝 / 箱體:VSSOP-8 封裝:Reel |
| PCA9519PW,112 | 功能描述:接口-信號緩沖器、中繼器 4CH LVLTRAN RoHS:否 制造商:Texas Instruments 工作電源電壓: 工作溫度范圍: 安裝風格:SMD/SMT 封裝 / 箱體:VSSOP-8 封裝:Reel |
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