
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
33887
21
DWB SUFFIX
(54-LEAD SOICW EXPOSED PAD)
PLASTIC PACKAGE
CASE 1377-01
ISSUE B
NOTES:
1.
ALL DIMENSIONS ARE IN MILLIMETERS.
2.
DIMENSIONING AND TOLERANCING PER ASME Y14.5M,
1994.
3.
DATUMS B AND C TO BE DETERMINED AT THE PLANE
WHERE THE BOTTOM OF THE LEADS EXIT THE PLASTIC
BODY.
4.
THIS DIMENSION DOES NOT INCLUDE MOLD FLASH,
PROTRUSION OR GATE BURRS. MOLD FLASH,
PROTRUSION OR GATE BURRS SHALL NOT EXCEED 0.15
MM PER SIDE. THIS DIMENSION IS DETERMINED AT THE
PLANE WHERE THE BOTTOM OF THE LEADS EXIT THE
PLASTIC BODY.
5.
THIS DIMENSION DOES NOT INCLUDE INTERLEAD FLASH
OR PROTRUSIONS. INTERLEAD FLASH AND
PROTRUSIONS SHALL NOT EXCEED 0.25 MM PER SIDE.
THIS DIMENSION IS DETERMINED AT THE PLANE WHERE
THE BOTTOM OF THE LEADS EXIT THE PLASTIC BODY.
6.
THIS DIMENSION DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL
NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46 MM.
DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS
OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSION
AND ADJACENT LEAD SHALL NOT LESS THAN 0.07 MM.
7.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
8.
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.1 MM AND 0.3 MM FROM THE LEAD TIP.
9.
THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE
BOTTOM. THIS DIMENSION IS DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVEOF MOLDFLASH,TIE BARBURRS, GATEBURRS
AND INTER-LEAD FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY.
CL
17.8
7.4
1
27
28
54
0.10
A
2.35
SEATING
PLANE
0.9
SECTION B-B
0.65
R0.08 MIN
B
A
(0.29)
0.38
0.30
(0.25)
PLATING
BASE METAL
SECTION A-A
ROTATED 90 CLOCKWISE
°
8
0.25
0.22
9
5
0.13 M
C
AB
6
A
C
7.6
18.0
9
4
10.3
5.15
A
54X
52X
2.65
0.3 A
2X 27 TIPS
B C
BB
0.1
0.0
0.5
0°
8°
0°
0.25
GAUGE PLANE
MIN
PIN 1 INDEX
C
(1.43)
6.6
5.9
0.30
C
AB
4.8
4.3
0.30
C
AB
VIEW C-C