參數(shù)資料
型號： PALCE22V10-25KMB
廠商： CYPRESS SEMICONDUCTOR CORP
元件分類： PLD
英文描述： Flash-erasable Reprogrammable CMOS PAL Device
中文描述： FLASH PLD, 25 ns, CDFP24
封裝： CERPACK-24
文件頁數(shù)： 9/13頁
文件大小： 367K
代理商： PALCE22V10-25KMB
PALCE22V10
USE ULTRA37000
TM
FOR
ALL NEW DESIGNS
Document #: 38-03027 Rev. *B
Page 9 of 13
MILITARY SPECIFICATIONS Group A Subgroup
Testing
Ordering Information
I
(mA)
130
t
(ns)
5
t
(ns)
3
t
(ns)
4
Ordering Code
PALCE22V10-5PC
PALCE22V10-5JC
PALCE22V10-7JC
PALCE22V10-7PC
PALCE22V10-10JC
PALCE22V10-10PC
PALCE22V10-10JI
PALCE22V10-10PI
PALCE22V10-10LMB
5962-89841063X
PALCE22V10-10KMB
5962-8984106KX
PALCE22V10-10DMB
5962-8984106LX
PALCE22V10-15JC
PALCE22V10-15PC
PALCE22V10-15KMB
5962-8984102KX
PALCE22V10-15KMB
5962-8984103KX
PALCE22V10-15KMB
5962-8984105KX
PALCE22V10-15DMB
5962-8984102LX
PALCE22V10-15DMB
5962-8984103LX
PALCE22V10-15LMB
5962-89841033X
PALCE22V10-15LMB
5962-89841053X
PALCE22V10-25JC
PALCE22V10-25PC
PALCE22V10-25LMB
5962-89841043X
Package
Name
P13
J64
J64
P13
J64
P13
J64
P13
L64
Package Type
Operating
Range
Commercial
24-lead (300 MIL) Molded DIP
28-lead Plastic Leaded Chip Carrier
28-lead Plastic Leaded Chip Carrier
24-lead (300-Mil) Molded DIP
28-lead Plastic Leaded Chip Carrier
24-lead (300-Mil) Molded DIP
28-lead Plastic Leaded Chip Carrier
24-lead (300-Mil) Molded DIP
28-Square Leadless Chip Carrier
130
7.5
5
5
Commercial
90
10
6
7
Commercial
150
10
6
7
Industrial
Military
K73
24-lead Rectangular Cerpack
D14
24-lead (300 MIL) CerDIP
90
15
10
8
J64
P13
K73
28-lead Plastic Leaded Chip Carrier
24-lead (300-Mil) Molded DIP
24-lead Rectangular Cerpack
Commercial
120
15
10
8
Military
K73
24-lead Rectangular Cerpack
K73
24-lead Rectangular Cerpack
D14
24-lead (300 MIL) CerDIP
D14
24-lead (300 MIL) CerDIP
L64
28-Square Leadless Chip Carrier
L64
28-Square Leadless Chip Carrier
90
25
15
15
J64
P13
L64
28-lead Plastic Leaded Chip Carrier
24-lead (300-Mil) Molded DIP
28-square Leadless Chip Carrier
Commercial
120
25
15
15
Military
DC Characteristics
Parameter
V
OH
V
OL
V
IH
V
IL
I
IX
I
OZ
Subgroups
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
I
CC
1, 2, 3
Switching Characteristics
Parameter
t
PD
t
CO
t
S
t
H
Subgroups
9, 10, 11
9, 10, 11
9, 10, 11
9, 10, 11
DC Characteristics
Parameter
Subgroups
相關PDF資料
PDF描述
PALCE22V10-25PI Flash-erasable Reprogrammable CMOS PAL Device
PALC22V10B Reprogrammable CMOS PAL Device
PALC22V10D FLASG ERASABLE REPROGRAMMABLE CMOS PAL DEVICE
PALC22V10 ECONOLINE: RSS & RSD - 1kVDC and 3KVDC Isolation- Internal SMD Construction- UL94V-0 Package Material- Toroidal Magnetics- Efficiency to 85%- SMD5, SMD8, SMD10 and SMD12 case styles
PALCE22V10 Flash Erasable,Reprogrammable CMOS PAL Device(可擦除閃速，CMOS可重編程PAL器件)
相關代理商/技術參數(shù)
參數(shù)描述
PALCE22V10-25LMB 制造商:CYPRESS 制造商全稱:Cypress Semiconductor 功能描述:Flash Erasable, Reprogrammable CMOS PAL㈢ Device
PALCE22V10-25PC 制造商:Cypress Semiconductor 功能描述:
PALCE22V10-25PI 制造商:CYPRESS 制造商全稱:Cypress Semiconductor 功能描述:Flash Erasable, Reprogrammable CMOS PAL㈢ Device
PALCE22V10-5 制造商:CYPRESS 制造商全稱:Cypress Semiconductor 功能描述:Flash-erasable Reprogrammable CMOS PAL Device
PALCE22V10-5AC 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Electrically-Erasable PLD
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