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參數(shù)資料
| 型號： | P89LPC903FD |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 8-bit microcontrollers with two-clock 80C51 core 1 kB 3 V Flash with 128-byte RAM |
| 中文描述： | 8-BIT, FLASH, 7.3728 MHz, MICROCONTROLLER, PDSO8 |
| 封裝： | 3.90 MM, PLASTIC, MS-012, SOT-96-1, SO-8 |
| 文件頁數(shù)： | 51/55頁 |
| 文件大?。?/td> | 1236K |
| 代理商： | P89LPC903FD |
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Philips Semiconductors
P89LPC901/902/903
8-bit microcontrollers with two-clock 80C51 core
Product data
Rev. 04 — 21 November 2003
51 of 55
9397 750 12293
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
–
for packages with a thickness
≥
2.5 mm
–
for packages with a thickness < 2.5 mm and a volume
≥
350 mm
3
so called
thick/large packages.
below 240
°
C (SnPb process) or below 260
°
C (Pb-free process) for packages with
a thickness < 2.5 mm and a volume < 350 mm
3
so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all
times.
14.3.2
Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
–
larger than or equal to 1.27 mm, the footprint longitudinal axis is
preferred
to be
parallel to the transport direction of the printed-circuit board;
–
smaller than 1.27 mm, the footprint longitudinal axis
must
be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45
°
angle
to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250
°
C or
265
°
C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in
most applications.
14.3.3
Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time
must be limited to 10 seconds at up to 300
°
C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320
°
C.
相關(guān)PDF資料 |
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| P89LPC907FD | 71-331814-05S |
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| P89LPC907 | 8-bit microcontrollers with two-clock 80C51 core 1 kB 3 V Flash with 128-byte RAM |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| P89LPC903FD,112 | 功能描述:8位微控制器 -MCU 80C51 1K FL 128B RAM RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| P89LPC903FD112 | 制造商:NXP Semiconductors 功能描述:IC 8BIT MCU 80C51 12MHZ SOIC-8 |
| P89LPC904 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:8-bit microcontrollers with two-clock accelerated 80C51 core 1 kB 3 V byte-erasable Flash with 8-bit A/D converter |
| P89LPC904FD | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:8-bit microcontrollers with two-clock accelerated 80C51 core 1 kB 3 V byte-erasable Flash with 8-bit A/D converter |
| P89LPC904FD,529 | 功能描述:8位微控制器 -MCU 1K FL/128B RAM/ADC/STD P/OUT RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
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