參數(shù)資料
型號： OM13013,598
廠商： NXP Semiconductors
文件頁數(shù)： 24/61頁
文件大小： 0K
描述： BOARD DEMO IAR LPC1227 JLINKLITE
標準包裝： 1
類型： MCU
適用于相關(guān)產(chǎn)品： LPC1227
所含物品： 板
其它名稱： 568-6885
LPC122X
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 26 August 2011
30 of 61
NXP Semiconductors
LPC122x
32-bit ARM Cortex-M0 microcontroller
9.
Thermal characteristics
9.1 Thermal characteristics
The average chip junction temperature, Tj (C), can be calculated using the following
equation:
(1)
Tamb = ambient temperature (C),
Rth(j-a) = the package junction-to-ambient thermal resistance (C/W)
PD = sum of internal and I/O power dissipation
The internal power dissipation is the product of IDD and VDD. The I/O power dissipation of
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
T
j
T
amb
P
D
R
th j
a
–
+
=
Table 6.
Thermal characteristics
VDD = 3.0 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-a)
thermal resistance from
junction to ambient
JEDEC test board; no
air flow
LQFP64 package
-
61
-
C/W
LQFP48 package
86
-
C/W
Rth(j-c)
thermal resistance from
junction to case
JEDEC test board
LQFP64 package
-
19
-
C/W
LQFP48 package
36
-
C/W
Tj(max)
maximum junction
temperature
--150
C
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