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參數(shù)資料
| 型號(hào)： | NX25P16-VSI |
| 廠商： | WINBOND ELECTRONICS CORP |
| 元件分類： | PROM |
| 英文描述： | 16M X 1 FLASH 2.7V PROM, PDSO8 |
| 封裝： | 0.208 INCH, SOIC-8 |
| 文件頁數(shù)： | 37/43頁 |
| 文件大?。?/td> | 918K |
| 代理商： | NX25P16-VSI |
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W25P80 / W25P16 / W25P32
- 42 -
13. REVISION HISTORY
VERSION
DATE
PAGE
DESCRIPTION
A
03/05/04
New Create
B
03/24/04
MLP metal die pad notification; Under "Package
Types," figure 1 and packaging information.
C
04/19/04
Corrected timing diagrams for figure 16 (Read
Manufacturer / Device ID Diagram) and figure 17
(Read JEDEC ID). Added 8x6mm MLP Package for
W25P16/32.
D
05/06/04
Corrected dimensions in Packaging Information
section for 6x5mm and 8x6mm MLP.
E
06/28/04
Changed 200-mil SOIC reference to 208-mil SOIC.
Updated dimensional table for the 208milSOIC in the
packaging information. Added 208milSOIC and
removed 5x6mm MLP for W25P16.
F
10/07/04
Added Parameter Page data to Features, Block
Diagram (Figure 2), Status Register Memory
Protection, Instruction Set and Manufacturer and
Device Identification. Added Parameter Page timing
diagrams (Figures 20, 21, 22 and 23). Updated FR,
tCH AND tPE data in AC Electrical Characteristics
G
04/22/05
Updated AC and DC parameters and package type
descriptions. Removed 8-contact 6x5 and 8x6 MLP
packages from document. Corrected data in
Instruction Set. Updated package dimension symbols
for compliance.
H
06/14/05
Updated Important Notice
I
06/28/05
Changed NexFlash part numbers to Winbond part
numbers and updated ordering and contact
information
J
12/11/05
ALL
Updated data sheet to comply with Winbond
standard.
Updated FR and fR values in Operating Ranges
Table and AC Characteristics Table. Updated Read
Data (fR) values in Operating Range and AC
Characteristics Tables from 33MHz to 25MHz.
Corrected the pin assignment on table of pin
description of page 5.
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相關(guān)代理商/技術(shù)參數(shù) |
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| NX25P20 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:1M BIT 2M BIT AND 4M BIT SERIAL FLASH MEMORY WITH 10MHZ SPI |
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