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參數資料
| 型號： | NX25P16-VSI |
| 廠商： | WINBOND ELECTRONICS CORP |
| 元件分類： | PROM |
| 英文描述： | 16M X 1 FLASH 2.7V PROM, PDSO8 |
| 封裝： | 0.208 INCH, SOIC-8 |
| 文件頁數： | 23/43頁 |
| 文件大?。?/td> | 918K |
| 代理商： | NX25P16-VSI |
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W25P80 / W25P16 / W25P32
Publication Release Date: December 11, 2005
- 3 -
Revision J
9.2.8
Fast Read (0Bh) .............................................................................................................19
9.2.9
Page Program (02h) .......................................................................................................20
9.2.10
Sector Erase (D8h).......................................................................................................21
9.2.11
Chip Erase (C7h)..........................................................................................................22
9.2.12
Power-down (B9h) ........................................................................................................23
9.2.13
Release Power-down / Device ID (ABh) .......................................................................23
9.2.14
Read Manufacturer / Device ID (90h) ...........................................................................25
9.2.15
JEDEC ID (9Fh)............................................................................................................26
9.2.16
Read Parameter Page (53h).........................................................................................27
9.2.17
Fast Read Parameter Page (5Bh) ................................................................................28
9.2.18
Program Parameter Page (52h) ...................................................................................29
9.2.19
Erase Parameter Page (D5h) .......................................................................................31
10.
ELECTRICAL CHARACTERISTICS......................................................................................... 32
10.1
Absolute Maximum Ratings (1) .................................................................................... 32
10.2
Operating Ranges......................................................................................................... 32
10.3
Power-up Timing and Write Inhibit Threshold .............................................................. 33
10.4
DC Electrical Characteristics (Preliminary)(1) .............................................................. 34
10.5
AC Measurement Conditions........................................................................................ 35
10.6
AC Electrical Characteristics ........................................................................................ 36
10.7
Serial Output Timing ..................................................................................................... 38
10.8
Input Timing .................................................................................................................. 38
10.9
Hold Timing................................................................................................................... 38
11.
PACKAGE SPECIFICATION .................................................................................................... 39
11.1
8-Pin SOIC 208-mil (Winbond Package Code SS) (NexFlash Package Code S)........ 39
11.2
16-Pin SOIC 300-mil (Winbond Package Code SF)(NexFlash Package Code F)....... 40
12.
ORDERING INFORMATION .................................................................................................... 41
13.
REVISION HISTORY ................................................................................................................42
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