參數(shù)資料
型號: NTE3034A
廠商: NTE Electronics, Inc.
英文描述: Phototransistor Detector
中文描述: 光電探測器
文件頁數(shù): 1/2頁
文件大?。?/td> 19K
代理商: NTE3034A
NTE3034A
Phototransistor Detector
Description:
The NTE3034A is designed for industrial processing and control applications such as light modula-
tors, shaft or position encoders, and end tape detectors. The NTE3034A is designed to be used with
the NTE3029A infrared emitter in optical slotted coupler/interrupter applications.
Features:
Economical, Miniature Plastic Package
Package Designed for Accurate Positioning
Lens Molded into Package
Absolute Maximum Ratings:
Collector–Emitter Voltage, V
CEO
Total Device Dissipation (T
A
= +25
°
C), P
D
Derate Above 25
°
C (Note 1)
Operating Junction Temperature Range, T
J
Storage Temperature Range, T
stg
Lead Temperature (During Soldering, 1/16” from case, 5sec max., Note 2), T
L
30V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
150mW
2mW/
°
C
–40
°
to +100
°
C
–40
°
to +100
°
C
. . . . . . . . . .
+260
°
C
Electrical Characteristics:
(T
A
= +25
°
C unless otherwise specified)
Parameter
Collector Dark Current
Collector–Emitter Breakdown Voltage
Symbol
I
D
V
(BR)CEO
I
C
= 10mA, H
Test Conditions
V
CE
= 10V, H
Min
30
Typ
Max Unit
100
0
0
nA
V
Optical Characteristics:
(T
A
= +25
°
C unless otherwise specified)
Parameter
Collector Light Current
Turn–On Time
Turn–Off Time
Saturation Voltage
Wavelength of Maximum Sensitivity
Symbol
I
L
t
on
t
off
V
CE(sat)
λ
s
Test Conditions
Min
100
Typ
500
60
0.25
0.25
0.8
Max Unit
0.4
0.4
V
CE
= 5V, H = 500
μ
W/cm
2
H = 5mW/cm
2
, V
CC
= 5V,
R
L
= 2400
μ
A
μ
s
μ
s
V
μ
m
H = 5mW/cm
2
, I
C
= 2mA, V
CC
= 5V
Note 1. Measured with device soldered into a typical PC board.
Note 2. Heat sink should be applied to leads during soldering to prevent case temperature from ex-
ceeding +100
°
C.
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