參數(shù)資料
型號(hào): NCV7356D2R2G
廠商: ON Semiconductor
文件頁(yè)數(shù): 13/24頁(yè)
文件大?。?/td> 0K
描述: IC TXRX CAN SGL WIRE 14-SOIC
標(biāo)準(zhǔn)包裝: 1
類(lèi)型: 收發(fā)器
驅(qū)動(dòng)器/接收器數(shù): 1/1
規(guī)程: CAN
電源電壓: 5 V ~ 27 V
安裝類(lèi)型: 表面貼裝
封裝/外殼: 14-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 14-SOICN
包裝: 剪切帶 (CT)
其它名稱(chēng): NCV7356D2R2GOSCT
NCV7356
http://onsemi.com
20
SOIC14 Thermal Information
Parameter
Test Condition, Typical Value
Unit
Min Pad Board
(Note 24)
1, Pad Board
(Note 25)
JunctiontoLead (psiJL8, YJL8)
30
°C/W
JunctiontoAmbient (RqJA, qJA)
122
84
°C/W
24.1 oz copper, 94 mm2 coper area, 0.062″ thick FR4.
25.1 oz copper, 767 mm2 coper area, 0.062″ thick FR4.
Figure 17. Internal construction of the package
simulation.
Figure 18. Min pad is shown as the red traces.
1 inch pad includes the yellow area. Pin 1, 7, 8 and
14 are connected to flag internally to the package
and externally to the heat spreading area.
60
70
80
90
100
110
120
130
140
150
0
100
200
300
400
500
600
800
2.0 oz. Cu
q
JA
C/W)
Copper Area (mm2)
1.0 oz. Cu
700
Figure 19. SOIC14, qJA as a Function of the Pad Copper Area Including Traces,
Board Material
900
Sim 1.0 oz.
Sim 2.0 oz.
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