參數(shù)資料
型號: MURF820
廠商: ON SEMICONDUCTOR
元件分類: 整流器
英文描述: 8 A, 200 V, SILICON, RECTIFIER DIODE, TO-220
文件頁數(shù): 3/4頁
文件大?。?/td> 81K
代理商: MURF820
MURF820
3
Rectifier Device Data
TEST CONDITIONS FOR ISOLATION TESTS*
MOUNTED
FULLY ISOLATED
PACKAGE
LEADS
HEATSINK
0.110
″ MIN
Figure 3. Clip Mounting Position
for Isolation Test Number 1
* Measurement made between leads and heatsink with all leads shorted together.
CLIP
MOUNTED
FULLY ISOLATED
PACKAGE
LEADS
HEATSINK
CLIP
0.107
″ MIN
MOUNTED
FULLY ISOLATED
PACKAGE
LEADS
HEATSINK
0.107
″ MIN
Figure 4. Clip Mounting Position
for Isolation Test Number 2
Figure 5. Screw Mounting Position
for Isolation Test Number 3
MOUNTING INFORMATION**
4–40 SCREW
PLAIN WASHER
HEATSINK
COMPRESSION WASHER
NUT
CLIP
HEATSINK
Laboratory tests on a limited number of samples indicate, when using the screw and compression washer mounting technique, a screw torque of 6 to 8 in . lbs is sufficient to provide
maximum power dissipation capability. The compression washer helps to maintain a constant pressure on the package over time and during large temperature excursions.
Destructive laboratory tests show that using a hex head 4–40 screw, without washers, and applying a torque in excess of 20 in . lbs will cause the plastic to crack around the mounting
hole, resulting in a loss of isolation capability.
Additional tests on slotted 4–40 screws indicate that the screw slot fails between 15 to 20 in . lbs without adversely affecting the package. However, in order to positively ensure
the package integrity of the fully isolated device, Motorola does not recommend exceeding 10 in . lbs of mounting torque under any mounting conditions.
Figure 6. Typical Mounting Techniques
6a. Screw–Mounted
6b. Clip–Mounted
**For more information about mounting power semiconductors see Application Note AN1040.
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