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參數(shù)資料
| 型號(hào)： | MTD20N03HDL |
| 廠商： | 飛思卡爾半導(dǎo)體(中國)有限公司 |
| 英文描述： | 1.5 A Switch-Mode Power Supply with Linear Regulator |
| 中文描述： | 1.5開關(guān)模式電源，線性穩(wěn)壓器 |
| 文件頁數(shù)： | 5/38頁 |
| 文件大?。?/td> | 739K |
| 代理商： | MTD20N03HDL |
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Analog Integrated Circuit Device Data
Freescale Semiconductor
5
34701
MAXIMUM RATINGS
MAXIMUM RATINGS
Table 2.
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Maximum Ratings
Rating
Symbol
Value
Unit
Electrical Ratings
Supply Voltage
V
IN1
, V
IN2
-0.3 to 7.0
V
Switching Node Voltage
V
SW
-1.0 to 7.0
V
Buck Regulator Bootstrap Input Voltage (BOOT - SW)
V
IN(BOOT)
-0.3 to 8.5
V
Boost Regulator Output Voltage
V
BST
-0.3 to 8.5
V
Boost Regulator Drain Voltage
V
BD
-0.3 to 9.5
V
RST
Drain Voltage
V
RST
-0.3 to 7.0
V
Enable Terminal Voltage at EN1, EN2
V
EN
-0.3 to 7.0
V
Logic Terminal Voltage at SDA, SCL
V
LOG
-0.3 to 7.0
V
Analog Terminal Voltage
LDO, VOUT,
RST
LDRV, LCMP, CS
V
OUT
V
LIN
-0.3 to 7.0
-0.3 to 8.5
V
Terminal Voltage at CLKSEL, ADDR, RT, FREQ, VDDI, CLKSYN, INV,
LFB
V
LOGIC
-0.3 to 3.6
V
ESD Voltage
(1)
Human Body Model
Machine Model
V
ESD
±2000
±200
V
Thermal Ratings
Storage Temperature
T
STG
-65 to 150
°
C
Lead Soldering Temperature
(2)
T
SOLDER
260
°
C
Maximum Junction Temperature
T
JMAX
125
°
C
Thermal Resistance
Junction to Ambient (Single Layer)
(3)
,
(4)
Junction to Ambient (Four Layers)
(3)
,
(4)
R
θ
JA
70
55
°
C/W
Thermal Resistance, Junction to Base
(5)
R
θ
JB
18
°
C/W
Operational Package Temperature (Ambient Temperature)
T
A
-40 to 85
°C
Notes
1.
ESD1 testing is performed in accordance with the Human Body Model (C
ZAP
=100 pF, R
ZAP
=1500
), ESD2 testing is performed in
accordance with the Machine Model (C
ZAP
=200 pF, R
ZAP
=0
), and the Charge Device Model.
Lead soldering temperature limit is for 10 seconds maximum duration.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature,
ambient temperature, air flow, power dissipation of other components on the board and board thermal resistance.
Per JEDEC JESD51-6 with the board horizontal
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top
surface of the board near the package.
2.
3.
4.
5.
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