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參數(shù)資料
| 型號(hào)： | MSSP25250-70-R |
| 元件分類： | PIN二極管 |
| 英文描述： | 350 V, SILICON, PIN DIODE |
| 封裝： | 1.5 X 0.76 MM, 0.2 MM HEIGHT, ROHS COMPLIANT, CASE 70, 2 PIN |
| 文件頁(yè)數(shù)： | 3/8頁(yè) |
| 文件大?。?/td> | 487K |
| 代理商： | MSSP25250-70-R |
TEL: 603-641-SEMI (7364) metelics-sales@aeroflex.com www.aeroflex.com/metelics
Revision Date: 6/3/09
3
SEMI-SCALETM PIN Diodes
Part Number Ordering Information:
Assembly Instructions
The SEMI-SCALE
TM
PIN Diodes are capable of being placed onto circuit boards with pick and place manufacturing
equipment from standard waffle-pack or 7 “ and 13” diameter tape-reel dispensing. The devices are attached to the
circuit board using conventional solder re-flow or wave soldering procedures with RoHS type or Sn 63 / Pb 37 type
solders per Table I and Graph I Time-Temperature recommended profile.
Table 1: Time-Temperature Profile for Sn 60/Pb40 or RoHS Type Solders
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Average ramp-up rate
3°C/second maximum
(TL to TP)
Preheat
- Temperature Minimum (TSMIN)
100°C
150°C
- Temperature Maximum (TSMAX)
150°C
200°C
- Time (Minimum to maximum) (ts)
60-120 seconds
60-180 seconds
TSMAX to TL
- Ramp-up Rate
3°C/second maximum
Time Maintauined above:
- Temperature (TL)
183°C
217°C
- Time (tL)
60-150 seconds
Peak Temperature (TP)
225 +0 / -5°C
245 +0/-5°C
Time within 5°C of actual
Peak Temperature (TP)
10-30 seconds
20-40 seconds
Ramp-down Rate
6°C/second maximum
Time 25°C to Peak Temperature
6 minutes maximum
8 minutes maximum
Part Number
Packaging
MSSP25250-70-W
Waffle-Pack
MSSP25250-70-R
Tape-Reel
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