參數(shù)資料
型號： MSP430G2412IRSA16T
廠商： TEXAS INSTRUMENTS INC
元件分類： 微控制器/微處理器
英文描述： 16-BIT, FLASH, 16 MHz, RISC MICROCONTROLLER, PQCC16
封裝： GREEN, PLASTIC, QFN-16
文件頁數(shù)： 30/59頁
文件大?。?/td> 1020K
代理商： MSP430G2412IRSA16T
MSP430G2x52
MSP430G2x12
SLAS722D
– DECEMBER 2010 – REVISED AUGUST 2011
RAM
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
V(RAMh)
RAM retention supply voltage (1)
CPU halted
1.6
V
(1)
This parameter defines the minimum supply voltage VCC when the data in RAM remains unchanged. No program execution should
happen during this supply voltage condition.
JTAG and Spy-Bi-Wire Interface
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
UNIT
fSBW
Spy-Bi-Wire input frequency
2.2 V
0
20
MHz
tSBW,Low
Spy-Bi-Wire low clock pulse length
2.2 V
0.025
15
s
Spy-Bi-Wire enable time
tSBW,En
2.2 V
1
s
(TEST high to acceptance of first clock edge(1))
tSBW,Ret
Spy-Bi-Wire return to normal operation time
2.2 V
15
100
s
fTCK
TCK input frequency(2)
2.2 V
0
5
MHz
RInternal
Internal pulldown resistance on TEST
2.2 V
25
60
90
k
(1)
Tools accessing the Spy-Bi-Wire interface need to wait for the maximum tSBW,En time after pulling the TEST/SBWCLK pin high before
applying the first SBWCLK clock edge.
(2)
fTCK may be restricted to meet the timing requirements of the module selected.
JTAG Fuse
(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
VCC(FB)
Supply voltage during fuse-blow condition
TA = 25°C
2.5
V
VFB
Voltage level on TEST for fuse blow
6
7
V
IFB
Supply current into TEST during fuse blow
100
mA
tFB
Time to blow fuse
1
ms
(1)
Once the fuse is blown, no further access to the JTAG/Test, Spy-Bi-Wire, and emulation feature is possible, and JTAG is switched to
bypass mode.
36
Copyright
2010–2011, Texas Instruments Incorporated
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