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Semiconductor
MSM6650 Family
CONTENTS
Standalone Mode
FEATURES ......................................................................................................................................... 5
BLOCK DIAGRAMS......................................................................................................................... 7
PIN CONFIGURATION................................................................................................................. 10
PIN DESCRIPTIONS ...................................................................................................................... 13
ABSOLUTE MAXIMUM RATINGS............................................................................................... 18
RECOMMENDED OPERATING CONDITIONS ........................................................................ 18
ELECTRICAL CHARACTERISTICS .............................................................................................. 19
TIMING DIAGRAMS ....................................................................................................................... 21
FUNCTIONAL DESCRIPTION ...................................................................................................... 23
1. PLAYBACK CODE SPECIFICATION .............................................................................................................
23
2. INTERNAL ROM USAGE AND DISABLED AREA .....................................................................................
23
3. PULL-UP/PULL-DOWN RESISTOR ...............................................................................................................
23
4. OPTION(S) ............................................................................................................................................................
24
5. STANDALONE MODE ......................................................................................................................................
24
6. SAMPLING FREQUENCY.................................................................................................................................
30
7. VOICE PLAYBACK TIME .................................................................................................................................
31
8. CHANNEL STATUS ...........................................................................................................................................
31
9. PLAYBACK METHOD .......................................................................................................................................
31
10. STANDBY CONVERSION.................................................................................................................................
34
11. VOICE OUTPUT ..................................................................................................................................................
34
12. LOW-PASS FILTER POP NOISE ......................................................................................................................
36
13. RC OSCILLATION ..............................................................................................................................................
37
14. CERAMIC OSCILLATION ................................................................................................................................
41
15. POWER SUPPLY .................................................................................................................................................
42
APPLICATION CIRCUITS .............................................................................................................. 43