參數(shù)資料
型號: MSM63P180-NGS-BK
廠商: LAPIS SEMICONDUCTOR CO LTD
元件分類: 微控制器/微處理器
英文描述: 4-BIT, OTPROM, 2 MHz, MICROCONTROLLER, PQFP176
封裝: 24 X 24 MM, 0.50 MM PITCH, PLASTIC, LQFP-176
文件頁數(shù): 30/36頁
文件大?。?/td> 236K
代理商: MSM63P180-NGS-BK
Semiconductor
MSM63P180
35/35
(Unit : mm)
PACKAGE DIMENSIONS
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
LQFP176-P-2424-0.50-BK
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5
mm or more
1.87 TYP.
Mirror finish
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