參數(shù)資料
型號: MSC8144ESVT1000B
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 數(shù)字信號處理
英文描述: 133 MHz, OTHER DSP, PBGA783
封裝: 29 X 29 MM, LEAD FREE, PLASTIC, FCPBGA-783
文件頁數(shù): 71/80頁
文件大?。?/td> 1251K
代理商: MSC8144ESVT1000B
Hardware Design Considerations
MSC8144E Quad Core Digital Signal Processor Data Sheet, Rev. 14
Freescale Semiconductor
73
3.4.5
UTOPIA/POS Related Pins
Table 62 lists the board connections of the UTOPIA/POS pins when the entire UTOPIA/POS interface is not used or subset of
UTOPIA/POS interface is used. For multiplexing options that select a subset of the UTOPIA/POS interface, use the connections
described in Table 62 for those signals that are not selected. Table 62 assumes that the alternate function of the specified pin is
not used. If the alternate function is used, connect that pin as required to support the selected function.
3.4.6
TDM Interface Related Pins
Table 63 lists the board connections of the TDM pins when an entire specific TDM is not used. For multiplexing options that
select a subset of a TDM interface, use the connections described in Table 63 for those signals that are not selected. Table 63
assumes that the alternate function of the specified pin is not used. If the alternate function is used, connect that pin as required
to support the selected function.
Table 62. Connectivity of UTOPIA/POS Related Pins When UTOPIA/POS Interface Is Not Used
Signal Name
Pin Connection
UTP_IR
GND
UTP_RADDR[0–4]
VDDIO
UTP_RCLAV_PDRPA
NC
UTP_RCLK
GND
UTP_RD[0–15]
GND
UTP_REN
VDDIO
UTP_RPRTY
GND
UTP_RSOC
GND
UTP_TADDR[0–4]
VDDIO
UTP_TCLAV
NC
UTP_TCLK
GND
UTP_TD[0–15]
NC
UTP_TEN
VDDIO
UTP_TPRTY
NC
UTP_TSOC
NC
VDDIO
3.3 V
Table 63. Connectivity of TDM Related Pins When TDM Interface Is Not Used
Signal Name
Pin Connection
TDMxRCLK
GND
TDMxRDAT
GND
TDMxRSYN
GND
TDMxTCLK
GND
TDMTxDAT
GND
TDMxTSYN
GND
VDDIO
3.3 V
Notes:
1.
x = {0, 1, 2,3, 4, 5, 6, 7}
2.
In case of subset of TDM interface usage please make sure to disable unused TDM modules. See Chapter 20, TDM, in the
MSC8144E Reference Manual for details.
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