參數(shù)資料
型號(hào)： MSC8126TMP6400
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 數(shù)字信號(hào)處理
英文描述： 0-BIT, 400 MHz, OTHER DSP, PBGA431
封裝： 20 X 20 MM, PLASTIC, FCBGA-431
文件頁(yè)數(shù)： 5/48頁(yè)
文件大?。?/td> 1138K
代理商： MSC8126TMP6400
Electrical Characteristics
MSC8126 Quad Digital Signal Processor Data Sheet, Rev. 15
Freescale Semiconductor
13
2
Electrical Characteristics
This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing
specifications. For additional information, see the MSC8126 Reference Manual.
In calculating timing requirements, adding a maximum value of one specification to a minimum value of another specification
does not yield a reasonable sum. A maximum specification is calculated using a worst case variation of process parameter values
in one direction. The minimum specification is calculated using the worst case for the same parameters in the opposite direction.
Therefore, a “maximum” value for a specification never occurs in the same device with a “minimum” value for another
specification; adding a maximum to a minimum represents a condition that can never exist.
Table 2 describes the maximum electrical ratings for the MSC8126.
CAUTION
This device contains circuitry protecting against damage
due to high static voltage or electrical fields; however,
normal precautions should be taken to avoid exceeding
maximum voltage ratings. Reliability is enhanced if unused
inputs are tied to an appropriate logic voltage level (for
example, either GND or VDD).
Table 2. Absolute Maximum Ratings
Rating
Symbol
Value
Unit
Core and PLL supply voltage
VDD
–0.2 to 1.6
V
I/O supply voltage
VDDH
–0.2 to 4.0
V
Input voltage
VIN
–0.2 to 4.0
V
Maximum operating temperature:
400 MHz
500 MHz
TJ
105
90
°C
Minimum operating temperature
400 MHz
500 MHz
TJ
–40
0
°C
Storage temperature range
TSTG
–55 to +150
°C
Notes:
1.
Functional operating conditions are given in Table 3.
2.
Absolute maximum ratings are stress ratings only, and functional operation at the maximum is not guaranteed. Stress beyond
the listed limits may affect device reliability or cause permanent damage.
3.
Section 3.5, Thermal Considerations includes a formula for computing the chip junction temperature (TJ).
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