參數(shù)資料
型號(hào)： MSC8126TMP6400
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 數(shù)字信號(hào)處理
英文描述： 0-BIT, 400 MHz, OTHER DSP, PBGA431
封裝： 20 X 20 MM, PLASTIC, FCBGA-431
文件頁(yè)數(shù)： 40/48頁(yè)
文件大小： 1138K
代理商： MSC8126TMP6400
Package Information
MSC8126 Quad Digital Signal Processor Data Sheet, Rev. 15
Freescale Semiconductor
45
5
Package Information
6
Product Documentation
MSC8126 Technical Data Sheet (MSC8126). Details the signals, AC/DC characteristics, clock signal characteristics,
package and pinout, and electrical design considerations of the MSC8126 device.
MSC8126 Reference Manual (MSC8126RM). Includes functional descriptions of the extended cores and all the
internal subsystems including configuration and programming information.
Application Notes. Cover various programming topics related to the StarCore DSP core and the MSC8126 device.
SC140 DSP Core Reference Manual. Covers the SC140 core architecture, control registers, clock registers, program
control, and instruction set.
Figure 35. MSC8126 Mechanical Information, 431-pin FC-PBGA Package
Notes:
1. All dimensions in millimeters.
2. Dimensioning and tolerancing
per ASME Y14.5M–1994.
3. Features are symmetrical about
the package center lines unless
dimensioned otherwise.
4. Maximum solder ball diameter
measured parallel to Datum A.
5. Datum A, the seating plane, is
determined by the spherical
crowns of the solder balls.
6. Parallelism measurement shall
exclude any effect of mark on
top surface of package.
7. Capacitors may not be present
on all devices.
8. Caution must be taken not to
short capacitors or exposed
metal capacitor pads on
package top.
9. FC CBGA (Ceramic) package
code: 5238.
FC PBGA (Plastic) package
code: 5263.
10.Pin 1 indicator can be in the
form of number 1 marking or an
“L” shape marking.
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